Embedded Solutions Page 31
Thermal Considerations
The IP-429 design consists of CMOS circuits. The power dissipation due to internal
circuitry is very low. It is possible to create higher power dissipation with the externally
connected logic. If more than one a Watt is required to be dissipated due to external
loading then forced air cooling is recommended. With the one degree differential
temperature to the solder side of the board, external cooling is easily accomplished.
Warranty and Repair
Please refer to the warranty page on our website for the current warranty offered and
options.
http://www.dyneng.com/warranty.html
Service Policy
Before returning a product for repair, verify as well as possible that the suspected unit is
at fault. Then call the Customer Service Department for a RETURN MATERIAL
AUTHORIZATION (RMA) number. Carefully package the unit, in the original shipping
carton if this is available, and ship prepaid and insured with the RMA number clearly
written on the outside of the package. Include a return address and the telephone
number of a technical contact. For out-of-warranty repairs, a purchase order for repair
charges must accompany the return. Dynamic Engineering will not be responsible for
damages due to improper packaging of returned items. For service on Dynamic
Engineering Products not purchased directly from Dynamic Engineering contact your
reseller. Products returned to Dynamic Engineering for repair by other than the original
customer will be treated as out-of-warranty.
Out of Warranty Repairs
Out of warranty repairs will be billed on a material and labor basis. The current minimum
repair charge is $150. Customer approval will be obtained before repairing any item if
the repair charges will exceed one half of the quantity one list price for that unit. Return
transportation and insurance will be billed as part of the repair and is in addition to the
minimum charge.