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Manufacturing information
Recommended solder reflow cycle
XBee Wi-Fi RF Module User Guide
196
Recommended solder reflow cycle
The following table lists the recommended solder reflow cycle. The chart shows the temperature
setting and the time to reach the temperature.
Time (seconds)
Temperature (°C)
30
65
60
100
90
135
120
160
150
195
180
240
210
260
The maximum temperature should not exceed 260 °C.
The device reflows during this cycle, and must not be reflowed upside down. Be careful not to jar the
device while the solder is molten, as parts inside the device can be removed from their required
locations.
Hand soldering is possible and should be done in accordance with approved standards.
This device has a Moisture Sensitivity Level (MSL) of 3.
Recommended footprint
We recommend that you use the PCB footprints in the following drawings for surface mounting. The
first drawing shows the surface mount module.