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72-Mbit QDR™-II+ SRAM 4-Word Burst

Architecture (2.0 Cycle Read Latency)

CY7C1541V18, CY7C1556V18
CY7C1543V18, CY7C1545V18

Cypress Semiconductor Corporation

198 Champion Court

San Jose

,

CA 95134-1709

408-943-2600

Document Number: 001-05389 Rev. *F

 Revised March 06, 2008

Features

Separate independent read and write data ports

Supports concurrent transactions

375 MHz clock for high bandwidth

4-word burst for reducing address bus frequency 

Double Data Rate (DDR) interfaces on both read and write ports 
(data transferred at 750 MHz) at 375 MHz 

Available in 2.0 clock cycle latency 

Two input clocks (K and K) for precise DDR timing

SRAM uses rising edges only

Echo clocks (CQ and CQ) simplify data capture in high-speed 
systems

Data valid pin (QVLD) to indicate valid data on the output

Single multiplexed address input bus latches address inputs 
for both read and write ports

Separate port selects for depth expansion

Synchronous internally self-timed writes

Available in x8, x9, x18, and x36 configurations

Full data coherency, providing most current data

Core V

DD

 = 1.8V ± 0.1V; IO V

DDQ

 = 1.4V to V

DD 

[1]

HSTL inputs and variable drive HSTL output buffers

Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)

Offered in both Pb-free and non Pb-free packages

JTAG 1149.1 compatible test access port

Delay Lock Loop (DLL) for accurate data placement

Configurations

With Read Cycle Latency of 2.0 cycles:

CY7C1541V18 – 8M x 8

CY7C1556V18 – 8M x 9

CY7C1543V18 – 4M x 18

CY7C1545V18 – 2M x 36

Functional Description

The CY7C1541V18, CY7C1556V18, CY7C1543V18, and
CY7C1545V18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR-II+ architecture. Similar to QDR-II archi-
tecture, QDR-II+ SRAMs consists of two separate ports: the read
port and the write port to access the memory array. The read port
has dedicated data outputs to support read operations and the
write port has dedicated data inputs to support write operations.
QDR-II+ architecture has separate data inputs and data outputs
to completely eliminate the need to “turn-around” the data bus
that exists with common IO devices. Each port is accessed
through a common address bus. Addresses for read and write
addresses are latched on alternate rising edges of the input (K)
clock. Accesses to the QDR-II+ read and write ports are
completely independent of one another. To maximize data
throughput, both read and write ports are equipped with DDR
interfaces. Each address location is associated with four 8-bit
words (CY7C1541V18), 9-bit words (CY7C1556V18), 18-bit
words (CY7C1543V18), or 36-bit words (CY7C1545V18) that
burst sequentially into or out of the device. Because data is trans-
ferred into and out of the device on every rising edge of both input
clocks (K and K), memory bandwidth is maximized while simpli-
fying system design by eliminating bus “turn-arounds”.

Depth expansion is accomplished with port selects, which
enables each port to operate independently.

All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.

Selection Guide

Description

375 MHz

333 MHz

300 MHz

Unit

Maximum Operating Frequency 

375

333

300

MHz

Maximum Operating Current 

x8

1300

1200

1100

mA

x9

1300

1200

1100

x18

1300

1200

1100

x36

1370

1230

1140

Note

1. The QDR consortium specification for V

DDQ

 is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting 

V

DDQ

= 1.4V to V

DD

.

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Summary of Contents for CY7C1541V18

Page 1: ...f two separate ports the read port and the write port to access the memory array The read port has dedicated data outputs to support read operations and the write port has dedicated data inputs to sup...

Page 2: ...g Reg 16 21 32 8 NWS 1 0 VREF Write Add Decode Write Reg 16 A 20 0 21 2M x 8 Array 2M x 8 Array 2M x 8 Array 8 CQ CQ DOFF Q 7 0 8 QVLD 8 8 8 Write Reg Write Reg Write Reg 2M x 9 Array CLK A 20 0 Gen K...

Page 3: ...8 BWS 1 0 VREF Write Add Decode Write Reg 36 A 19 0 20 1M x 18 Array 1M x 18 Array 1M x 18 Array 18 CQ CQ DOFF Q 17 0 18 QVLD 18 18 18 Write Reg Write Reg Write Reg 512K x 36 Array CLK A 18 0 Gen K K...

Page 4: ...S VSS VSS VDDQ NC NC Q0 M NC NC NC VSS VSS VSS VSS VSS NC NC D0 N NC D7 NC VSS A A A VSS NC NC NC P NC NC Q7 A A QVLD A A NC NC NC R TDO TCK A A A NC A A A TMS TDI CY7C1556V18 8M x 9 1 2 3 4 5 6 7 8 9...

Page 5: ...C D0 Q0 R TDO TCK A A A NC A A A TMS TDI CY7C1545V18 4M x 36 1 2 3 4 5 6 7 8 9 10 11 A CQ NC 288M A WPS BWS2 K BWS1 RPS A NC 144M CQ B Q27 Q18 D18 A BWS3 K BWS0 A D17 Q17 Q8 C D27 Q28 D19 VSS A NC A V...

Page 6: ...is organized as 8M x 8 4 arrays each of 2M x 8 for CY7C1541V18 8M x 9 4 arrays each of 2M x 9 for CY7C1556V18 4M x 18 4 arrays each of 1M x 18 for CY7C1543V18 and 2M x 36 4 arrays each of 512K x 36 f...

Page 7: ...be connected to a pull up through a 10 K or less pull up resistor The device behaves in QDR I mode when the DLL is turned off In this mode the device can be operated at a frequency of up to 167 MHz wi...

Page 8: ...he next rising edge of the positive input clock K This enables for a seamless transition between devices without the insertion of wait states in a depth expanded memory Write Operations Write operatio...

Page 9: ...e input clock of the QDR II The timing for the echo clocks is shown in Switching Characteristics on page 23 Valid Data Indicator QVLD QVLD is provided on the QDR II to simplify data capture on high sp...

Page 10: ...portion of a write sequence CY7C1541V18 only the upper nibble D 7 4 is written into the device D 3 0 remains unaltered CY7C1543V18 only the upper byte D 17 9 is written into the device D 8 0 remains...

Page 11: ...e device D 35 9 remains unaltered L H H H L H During the Data portion of a write sequence only the lower byte D 8 0 is written into the device D 35 9 remains unaltered H L H H L H During the Data port...

Page 12: ...be serially loaded into the instruction register This register is loaded when it is placed between the TDI and TDO pins as shown in TAP Controller Block Diagram on page 15 Upon power up the instructio...

Page 13: ...t the data by putting the TAP into the Shift DR state This places the boundary scan register between the TDI and TDO pins PRELOAD places an initial data pattern at the latched parallel outputs of the...

Page 14: ...State Diagram TEST LOGIC RESET TEST LOGIC IDLE SELECT DR SCAN CAPTURE DR SHIFT DR EXIT1 DR PAUSE DR EXIT2 DR UPDATE DR 1 0 1 1 0 1 0 1 0 0 0 1 1 1 0 1 0 1 0 0 0 1 0 1 1 0 1 0 0 1 1 0 SELECT IR SCAN CA...

Page 15: ...Voltage 0 65VDD VDD 0 3 V VIL Input LOW Voltage 0 3 0 35VDD V IX Input and Output Load Current GND VI VDD 5 5 A 0 0 1 2 29 30 31 Boundary Scan Register Identification Register 0 1 2 108 0 1 2 Instruct...

Page 16: ...TDI Hold after Clock Rise 5 ns tCH Capture Hold after Clock Rise 5 ns Output Times tTDOV TCK Clock LOW to TDO Valid 10 ns tTDOX TCK Clock LOW to TDO Invalid 0 ns TAP Timing and Test Conditions Figure...

Page 17: ...on Codes Instruction Code Description EXTEST 000 Captures the input and output ring contents IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO This o...

Page 18: ...35 10E 63 2A 91 3L 8 9R 36 10D 64 1A 92 1M 9 11P 37 9E 65 2B 93 1L 10 10P 38 10C 66 3B 94 3N 11 10N 39 11D 67 1C 95 3M 12 9P 40 9C 68 1B 96 1N 13 10M 41 9D 69 3D 97 2M 14 11N 42 11B 70 3C 98 3P 15 9M...

Page 19: ...ovide stable power and clock K K for 2048 cycles to lock the DLL DLL Constraints DLL uses K clock as its synchronizing input The input must have low phase jitter which is specified as tKC Var The DLL...

Page 20: ...GH Voltage Note 19 VDDQ 2 0 12 VDDQ 2 0 12 V VOL Output LOW Voltage Note 20 VDDQ 2 0 12 VDDQ 2 0 12 V VOH LOW Output HIGH Voltage IOH 0 1 mA Nominal Impedance VDDQ 0 2 VDDQ V VOL LOW Output LOW Voltag...

Page 21: ...e 14 Parameter Description Test Conditions Min Typ Max Unit VIH Input HIGH Voltage VREF 0 2 VDDQ 0 24 V VIL Input LOW Voltage 0 24 VREF 0 2 V Capacitance Tested initially and after any design or proce...

Page 22: ...1 11 82 C W JC Thermal Resistance Junction to Case 2 33 C W Figure 4 AC Test Loads and Waveforms 1 25V 0 25V R 50 5 pF INCLUDING JIG AND SCOPE ALL INPUT PULSES Device RL 50 Z0 50 VREF 0 75V VREF 0 75V...

Page 23: ...ns tCQDOH tCQHQX Echo Clock High to Data Invalid 0 2 0 2 0 2 ns tCQH tCQHCQL Output Clock CQ CQ HIGH 26 0 88 1 03 1 15 ns tCQHCQH tCQHCQH CQ Clock Rise to CQ Clock Rise 26 rising edge to rising edge 0...

Page 24: ...PS K K DON T CARE UNDEFINED CQ CQ tCQOH CCQO t tCQOH CCQO t tQVLD QVLD tQVLD Read Latency 2 0 Cycles CLZ t t CO tDOH tCQDOH CQD t tCHZ Q00 Q01 Q20 Q02 Q21 Q03 Q22 Q23 tCQH tCQHCQH Q Notes 31 Q00 refer...

Page 25: ...all Fine Pitch Ball Grid Array 15 x 17 x 1 4 mm Industrial CY7C1556V18 375BZI CY7C1543V18 375BZI CY7C1545V18 375BZI CY7C1541V18 375BZXI 51 85195 165 Ball Fine Pitch Ball Grid Array 15 x 17 x 1 4 mm Pb...

Page 26: ...00BZXC CY7C1541V18 300BZI 51 85195 165 Ball Fine Pitch Ball Grid Array 15 x 17 x 1 4 mm Industrial CY7C1556V18 300BZI CY7C1543V18 300BZI CY7C1545V18 300BZI CY7C1541V18 300BZXI 51 85195 165 Ball Fine P...

Page 27: ...CY7C1545V18 Document Number 001 05389 Rev F Page 27 of 28 Package Diagram Figure 6 165 ball FBGA 15 x 17 x 1 4 mm 51 85195 0 2 2 8 8 8 3 4 0 0 2 2 4 0 6 7 44 6 7 0 2 0 2 3 2 0 490 3 2 3 3 4 3 0 7 4 G...

Page 28: ...ice to the materials described herein Cypress does not assume any liability arising out of the application or use of any product or circuit described herein Cypress does not authorize its products for...

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