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Document Number: 001-05389 Rev. *F

Revised March 06, 2008

Page 28 of 28

QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress, IDT, NEC, Renesas, and Samsung. All product and company names mentioned in this document
are the trademarks of their respective holders.

CY7C1541V18, CY7C1556V18
CY7C1543V18, CY7C1545V18

© Cypress Semiconductor Corporation, 2005-2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used
for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use
as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support
systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. 

Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress. 

Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges. 

Use may be limited by and subject to the applicable Cypress software license agreement. 

Document History Page

Document Title: CY7C1541V18/CY7C1556V18/CY7C1543V18/CY7C1545V18, 72-Mbit QDR™-II+ SRAM 4-Word Burst Archi-
tecture (2.0 Cycle Read Latency)
Document Number: 001-05389

REV.

ECN NO.

ISSUE 

DATE

ORIG. OF 
CHANGE

DESCRIPTION OF CHANGE

**

403090

See ECN

VEE

New Data Sheet

*A

425252

See ECN

VEE

Updated the DLL Section
Fixed typos in the DC and AC parameter section
Updated the switching waveform
Updated the Power up sequence
Added additional parameters in the AC timing

*B

437000

See ECN

IGS

ECN for Show on web

*C

461934

See ECN

NXR

Moved the Selection Guide table from page# 3 to page# 1
Modified Application Diagram
Changed t

TH 

and t

TL 

from 40 ns to 20 ns, changed t

TMSS

, t

TDIS

, t

CS

, t

TMSH

, t

TDIH

, t

CH 

from

 

10 ns to 5 ns and changed t

TDOV 

from 20 ns to 10 ns in TAP AC Switching 

Characteristics table 
Modified Power Up waveform
Included Maximum ratings for Supply Voltage on V

DDQ

 Relative to GND

Changed the Maximum Ratings for DC Input Voltage from V

DDQ

 to V

DD

Changed the Pin Definition of I

X

 from Input Load current to Input Leakage current on 

page#18

*D

497567

See ECN

NXR

Changed the V

DDQ

 operating voltage to 1.4V to V

DD

 in the Features section, in 

Operating Range table and in the DC Electrical Characteristics table
Added foot note in page# 1
Changed the Maximum rating of Ambient Temperature with Power Applied from –10

°

to +85

°

C to –55

°

C to +125

°

Changed V

REF

 (Max) spec from 0.85V to 0.95V in the DC Electrical Characteristics 

table and in the note below the table
Updated footnote #21 to specify Overshoot and Undershoot Spec
Updated I

DD

 and I

SB

 values

Updated 

Θ

JA 

and 

Θ

JC 

values

Removed x9 part and its related information
Updated footnote #25

*E

1351243

See ECN

VKN/FSU

Converted from preliminary to final
Added x8 and x9 parts
Changed t

CYC

 max spec to 8.4 ns for all speed bins

Updated footnote# 23
Updated Ordering Information table

*F

2181046

See ECN VKN/AESA Added footnote# 22 related to I

DD

[+] Feedback 

[+] Feedback 

Summary of Contents for CY7C1541V18

Page 1: ...f two separate ports the read port and the write port to access the memory array The read port has dedicated data outputs to support read operations and the write port has dedicated data inputs to sup...

Page 2: ...g Reg 16 21 32 8 NWS 1 0 VREF Write Add Decode Write Reg 16 A 20 0 21 2M x 8 Array 2M x 8 Array 2M x 8 Array 8 CQ CQ DOFF Q 7 0 8 QVLD 8 8 8 Write Reg Write Reg Write Reg 2M x 9 Array CLK A 20 0 Gen K...

Page 3: ...8 BWS 1 0 VREF Write Add Decode Write Reg 36 A 19 0 20 1M x 18 Array 1M x 18 Array 1M x 18 Array 18 CQ CQ DOFF Q 17 0 18 QVLD 18 18 18 Write Reg Write Reg Write Reg 512K x 36 Array CLK A 18 0 Gen K K...

Page 4: ...S VSS VSS VDDQ NC NC Q0 M NC NC NC VSS VSS VSS VSS VSS NC NC D0 N NC D7 NC VSS A A A VSS NC NC NC P NC NC Q7 A A QVLD A A NC NC NC R TDO TCK A A A NC A A A TMS TDI CY7C1556V18 8M x 9 1 2 3 4 5 6 7 8 9...

Page 5: ...C D0 Q0 R TDO TCK A A A NC A A A TMS TDI CY7C1545V18 4M x 36 1 2 3 4 5 6 7 8 9 10 11 A CQ NC 288M A WPS BWS2 K BWS1 RPS A NC 144M CQ B Q27 Q18 D18 A BWS3 K BWS0 A D17 Q17 Q8 C D27 Q28 D19 VSS A NC A V...

Page 6: ...is organized as 8M x 8 4 arrays each of 2M x 8 for CY7C1541V18 8M x 9 4 arrays each of 2M x 9 for CY7C1556V18 4M x 18 4 arrays each of 1M x 18 for CY7C1543V18 and 2M x 36 4 arrays each of 512K x 36 f...

Page 7: ...be connected to a pull up through a 10 K or less pull up resistor The device behaves in QDR I mode when the DLL is turned off In this mode the device can be operated at a frequency of up to 167 MHz wi...

Page 8: ...he next rising edge of the positive input clock K This enables for a seamless transition between devices without the insertion of wait states in a depth expanded memory Write Operations Write operatio...

Page 9: ...e input clock of the QDR II The timing for the echo clocks is shown in Switching Characteristics on page 23 Valid Data Indicator QVLD QVLD is provided on the QDR II to simplify data capture on high sp...

Page 10: ...portion of a write sequence CY7C1541V18 only the upper nibble D 7 4 is written into the device D 3 0 remains unaltered CY7C1543V18 only the upper byte D 17 9 is written into the device D 8 0 remains...

Page 11: ...e device D 35 9 remains unaltered L H H H L H During the Data portion of a write sequence only the lower byte D 8 0 is written into the device D 35 9 remains unaltered H L H H L H During the Data port...

Page 12: ...be serially loaded into the instruction register This register is loaded when it is placed between the TDI and TDO pins as shown in TAP Controller Block Diagram on page 15 Upon power up the instructio...

Page 13: ...t the data by putting the TAP into the Shift DR state This places the boundary scan register between the TDI and TDO pins PRELOAD places an initial data pattern at the latched parallel outputs of the...

Page 14: ...State Diagram TEST LOGIC RESET TEST LOGIC IDLE SELECT DR SCAN CAPTURE DR SHIFT DR EXIT1 DR PAUSE DR EXIT2 DR UPDATE DR 1 0 1 1 0 1 0 1 0 0 0 1 1 1 0 1 0 1 0 0 0 1 0 1 1 0 1 0 0 1 1 0 SELECT IR SCAN CA...

Page 15: ...Voltage 0 65VDD VDD 0 3 V VIL Input LOW Voltage 0 3 0 35VDD V IX Input and Output Load Current GND VI VDD 5 5 A 0 0 1 2 29 30 31 Boundary Scan Register Identification Register 0 1 2 108 0 1 2 Instruct...

Page 16: ...TDI Hold after Clock Rise 5 ns tCH Capture Hold after Clock Rise 5 ns Output Times tTDOV TCK Clock LOW to TDO Valid 10 ns tTDOX TCK Clock LOW to TDO Invalid 0 ns TAP Timing and Test Conditions Figure...

Page 17: ...on Codes Instruction Code Description EXTEST 000 Captures the input and output ring contents IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO This o...

Page 18: ...35 10E 63 2A 91 3L 8 9R 36 10D 64 1A 92 1M 9 11P 37 9E 65 2B 93 1L 10 10P 38 10C 66 3B 94 3N 11 10N 39 11D 67 1C 95 3M 12 9P 40 9C 68 1B 96 1N 13 10M 41 9D 69 3D 97 2M 14 11N 42 11B 70 3C 98 3P 15 9M...

Page 19: ...ovide stable power and clock K K for 2048 cycles to lock the DLL DLL Constraints DLL uses K clock as its synchronizing input The input must have low phase jitter which is specified as tKC Var The DLL...

Page 20: ...GH Voltage Note 19 VDDQ 2 0 12 VDDQ 2 0 12 V VOL Output LOW Voltage Note 20 VDDQ 2 0 12 VDDQ 2 0 12 V VOH LOW Output HIGH Voltage IOH 0 1 mA Nominal Impedance VDDQ 0 2 VDDQ V VOL LOW Output LOW Voltag...

Page 21: ...e 14 Parameter Description Test Conditions Min Typ Max Unit VIH Input HIGH Voltage VREF 0 2 VDDQ 0 24 V VIL Input LOW Voltage 0 24 VREF 0 2 V Capacitance Tested initially and after any design or proce...

Page 22: ...1 11 82 C W JC Thermal Resistance Junction to Case 2 33 C W Figure 4 AC Test Loads and Waveforms 1 25V 0 25V R 50 5 pF INCLUDING JIG AND SCOPE ALL INPUT PULSES Device RL 50 Z0 50 VREF 0 75V VREF 0 75V...

Page 23: ...ns tCQDOH tCQHQX Echo Clock High to Data Invalid 0 2 0 2 0 2 ns tCQH tCQHCQL Output Clock CQ CQ HIGH 26 0 88 1 03 1 15 ns tCQHCQH tCQHCQH CQ Clock Rise to CQ Clock Rise 26 rising edge to rising edge 0...

Page 24: ...PS K K DON T CARE UNDEFINED CQ CQ tCQOH CCQO t tCQOH CCQO t tQVLD QVLD tQVLD Read Latency 2 0 Cycles CLZ t t CO tDOH tCQDOH CQD t tCHZ Q00 Q01 Q20 Q02 Q21 Q03 Q22 Q23 tCQH tCQHCQH Q Notes 31 Q00 refer...

Page 25: ...all Fine Pitch Ball Grid Array 15 x 17 x 1 4 mm Industrial CY7C1556V18 375BZI CY7C1543V18 375BZI CY7C1545V18 375BZI CY7C1541V18 375BZXI 51 85195 165 Ball Fine Pitch Ball Grid Array 15 x 17 x 1 4 mm Pb...

Page 26: ...00BZXC CY7C1541V18 300BZI 51 85195 165 Ball Fine Pitch Ball Grid Array 15 x 17 x 1 4 mm Industrial CY7C1556V18 300BZI CY7C1543V18 300BZI CY7C1545V18 300BZI CY7C1541V18 300BZXI 51 85195 165 Ball Fine P...

Page 27: ...CY7C1545V18 Document Number 001 05389 Rev F Page 27 of 28 Package Diagram Figure 6 165 ball FBGA 15 x 17 x 1 4 mm 51 85195 0 2 2 8 8 8 3 4 0 0 2 2 4 0 6 7 44 6 7 0 2 0 2 3 2 0 490 3 2 3 3 4 3 0 7 4 G...

Page 28: ...ice to the materials described herein Cypress does not assume any liability arising out of the application or use of any product or circuit described herein Cypress does not authorize its products for...

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