User Guide
DDOC0108-000-A2
CNS4 CSfC
2 - 3
Overview
Revision 1.0
2.1.2
FSM-C Module
CAUTION
EQUIPMENT DAMAGE. Do not remove / install a FSM-C module with power applied or damage to
the FSM-C module and / or CNS4 will occur.
CAUTION
EQUIPMENT DAMAGE. Use ESD precautions when handling a FSM-C module. Failure to
properly handle FSM-C modules can result in damage.
CAUTION
EQUIPMENT DAMAGE. Ensure wedge-lock levers are in closed position when FSM-C module is
installed in CNS4 chassis. The levers are thermally conductive and must be closed to provide
proper heat dissipation for the FSM-C module. Failure to close levers will result in improper
operation / failure of the FSM-C module.
Up to four FSM-C modules can be installed in the CNS4 chassis. Each FSM-C module is a 2.0 TB
storage module that uses EMLC type memory. The FSM-C modules are installed behind an
access door located on the front of the CNS4 chassis. Each FSM-C module has three status LEDs
and a removal request button. Refer to paragraph 3.3
FSM-C Module Controls / Indicators
for
information regarding the LEDs and button. Refer to Figure 2.2 for a block diagram of the FSM-C
module.
Figure 2.2
FSM-C Module Block Diagram
The FSM-C module design supports dynamic and static data wear-leveling enforcing an even
distribution of erase/write cycles. This prevents excessive writes to the same flash locations
extending the life cycle of the memory. An ECC engine is present to provide bit error detection and
correction in the physical NAND memory. In addition, a Bad Block Management (BBM) algorithm is
included to replace bad-blocks. Wear-leveling, ECC, and BBM techniques provide an extended
endurance rating for the FSM-C module storage. The FSM-C supports Serial Advanced
Technology Attachment (SATA I/II) interface bus. It is capable of data transfer rates of 1.5 Gbps
and 3.0 Gbps (SATA I and SATA II respectively).
The FSM-C model (Figure 2.3) enclosure is constructed of two custom-machined anodized
aluminum covers fastened together with screws. The internal structure is designed to dissipate
component heat and provide rigidity. This closed structure makes the FSM-C module less
susceptible to problems due to adverse environments and provides silent vibration-free operation.
The FSM-C module uses conduction cooling. Its internal structure transfers heat to a physically
connected aluminum enclosure, which in turn conducts the heat through the wedgelock guide rails
to the CNS4 chassis. The interconnect plug is keyed to ensure the FSM-C module is inserted
correctly into the CNS4 chassis.
The FSM-C module is NOT hot-swappable, the CNS4 MUST be powered down prior to removal or
installation of any modules. The module is removed by grasping a pair of wedgelock levers and
pulling them away from the module's body. An additional eject lever is provided to assist with
removing the module. After removal, the FSM-C module can be transported in an ESD-safe
carrying case.
Removal
Request
Button
Status LED
Fault LED
Power LED
SATA PORT
POWER
DDOC0108-0010
I2C Register EPROM
Temperature Sensor
Voltage Sensor
SYSTEM
MANAGEMENT
2.5 SATA
Solid State Drive
