Copyright
©
2013
congatec
AG
QMX6m03
23/63
4
Heatspreader
Thermal design is an important factor for systems. This factor is critical when the power dissipation level increases in certain high performance
use cases. To ensure the performance and reliability of the system, adequate thermal management technique such as the heatspreader is
necessary.
The heatspreader acts as a thermal coupling device to the module. It is thermally coupled to the CPU via a thermal gap filler and on some
modules, it may also be thermally coupled to other heat generating components with the use of additional thermal gap fillers. Although the
heatspreader is the thermal interface where most of the heat generated by the module is dissipated, it is not to be considered as a heatsink. It
has been designed as a thermal interface between the module and the application specific thermal solution.
The application specific thermal solution may use heatsinks with fans, and/or heat pipes, which can be attached to the heatspreader. Some
thermal solutions may also require that the heatspreader is attached directly to the systems chassis thereby using the whole chassis as a heat
dissipater.
congatec AG offers three heatspreader variants for the conga-QMX6. Each heatspreader variant is intended for specific conga-QMX6 modules
as shown in the table below:
Heatspreader
Variants
Heatspreader
Part No. (PN)
Compatible conga-QMX6
Variants (PN)
Comment
conga-QMX6/HSP1-B
016160
016112, 016113
For modules equipped with lidded FC-PBGA CPU (1mm Gap Pad)
conga-QMX6/HSP2-B
016161
016100, 016101, 016110, 016111
For modules equipped with MA-PBGA CPU (2mm Gap Pad)
conga-QMX6/HSP3-B
016162
016102, 016103, 016104
For modules equipped with non-lidded FC-PBGA CPU (heatstack solution)
Note
Currently, only a few Freescale
®
iMX6 on-chip devices are enabled by default in the bootloader. With this default configuration, the conga-QMX6
power consumption is low. However, power consumption may increase significantly depending on the application and the workload of the CPU.
Caution
congatec Qseven
®
heaspreaders have been specifically designed for use within commercial temperature ranges (0° to 60°C) only. When using
industrial temperature variants of the conga-QMX6 in industrial temperature ranges (-40° to 85°C), use of the conga-QMX6 heatspreaders is
not recommended by congatec; furthermore, its use is at the risk of the end user. It is the responsibility of the end user to design an optimized
thermal solution that meets the needs of their application within the industrial environmental conditions it operates in.
There are mounting holes on the heatspreader designed to attach the heatspreader to the module. These mounting holes must be used to
ensure that all components that are required to make contact with heatspreader do so. Failure to utilize these mounting holes will result in
improper contact between these components and heatspreader thereby reducing heat dissipation efficiency.
