DS861PP3
37
CS5346
10.PACKAGE DIMENSIONS
11.THERMAL CHARACTERISTICS AND SPECIFICATIONS
1.
JA
is specified according to JEDEC specifications for multi-layer PCBs.
INCHES
MILLIMETERS
DIM
MIN
NOM
MAX
MIN
NOM
MAX
A
---
0.055
0.063
---
1.40
1.60
A1
0.002
0.004
0.006
0.05
0.10
0.15
B
0.007
0.009
0.011
0.17
0.22
0.27
D
0.343
0.354
0.366
8.70
9.0 BSC
9.30
D1
0.272
0.28
0.280
6.90
7.0 BSC
7.10
E
0.343
0.354
0.366
8.70
9.0 BSC
9.30
E1
0.272
0.28
0.280
6.90
7.0 BSC
7.10
e*
0.016
0.020
0.024
0.40
0.50 BSC
0.60
L
0.018
0.24
0.030
0.45
0.60
0.75
0.000°
4°
7.000°
0.00°
4°
7.00°
* Nominal pin pitch is 0.50 mm
*Controlling dimension is mm.
*JEDEC Designation: MS022
Parameters
Symbol
Min
Typ
Max
Units
Package Thermal Resistance
48-LQFP
JA
JC
-
-
48
15
-
-
°C/Watt
°C/Watt
Allowable Junction Temperature
-
-
125
C
48L LQFP PACKAGE DRAWING
E1
E
D1
D
1
e
L
B
A1
A