Chassis Plans ATXP-875P, Technical Reference

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ATXP-875P Technical Reference Chapter 1: Pre-Configuration
Chassis Plans 5
Step 2 SDRAM, CPU, and Cables Installation
Depending upon how your ATXP-875P is configured you may need to install the following:
•
SDRAM (DIMMs)
•
CPU
ATXP-875P Memory Configuration
The ATXP-875P offers 4 DIMM memory sockets (Locations J6G1, J6G2, J6H1 and J6H2 – Figure 1-3 ). They can
be configured with 2.5V unbuffered SDRAM DDR modules. It is very important that the quality of the DIMMs is
good. Unreliable operation of the system may result if poor quality DIMMs are used. Always purchase your memory
from a reliable source. Please, refer to chapter 3 for memory details.
CPU Installation
The ATXP-875P currently supports the following CPUs:
•
Full series of Intel Pentium 4 400MHz, 533MHz and 800MHz PSB mPGA478 processors featuring Intel
Hyper-Threading technology.
Locate the CPU socket on your ATXP-875P system board (mPGA478
Socket – Location U21 –
Figure 1-4 ). To install the processor, lift the
lever of the ZIF socket and gently insert the CPU. The CPU will fit
only in the right alignment. Make sure the CPU is inserted all the way.
Lower the lever. Install the CPU fan. Make sure it is locked and
connected to J2F1 (see pin-out in Appendix A).
The continued push of technology to increase performance levels
(higher operating speeds) and packaging density (more transistors) is
aggravating the thermal management of the CPU. As operating
frequencies increase and packaging sizes decreases, the power density
increases and the thermal cooling solution space and airflow become
more constrained. The result is an increased importance on system
design to ensure that thermal design requirements are met for the CPU.
The objective of thermal management is to ensure that the temperature of the processor is maintained within
functional limits. The functional temperature limit is the range within which the electrical circuits can be expected to
meet their specified performance requirements. Operation outside the functional limit can degrade system
performance, cause logic errors or cause component and/or system damage. Temperatures exceeding the maximum
operating limits may result in irreversible changes in the operating characteristics of the component.
If the ATXP-875P industrial embedded motherboard is acquired without the CPU and the thermal solution,
extremely care must be taken to avoid improper thermal management. All Intel thermal solution specifications,
design guidelines and suggestions to the CPU being used must be followed. The ATXP-875P warranty is void if the
thermal management does not comply with Intel requirements.
1. Improper installation of the CPU may cause permanent damage to both the system
board and the CPU. – This is not covered by warranty.
2. Always handle the CPU by the edges, never touch the pins.
3. Always use a heat-sink and a CPU fan.