22
Appendix B
Design Verification Test Procedure
B1. Purpose
This standard establishes the environmental specification for projector related products, which
defines the level of product performance and reliability in the field. It is not necessary the intent of
these specification to simulate a typical user environment, but rather to provide for a level of product
robustness that when applied over a wide range of manufacturing variability and environmental
usage conditions, which is recommended for product assurance testing reference.
B2. Test Summary
B2.1 Dynamic Test
Specification
Package Drop
Drop test with packing gross weight and falling height relationship
Gross Weight
Falling Height (cm)
spec.
( Kg )
C3/C4/C5
MP
Remark
0.0<W<4.5 >106
106
4.5
≦
W<11.0 106
91
11.0
≦
W<20.5 91
76
20.5
≦
W<34.0 76
61
34.0
≦
W<45.5 61
46
45.5
≦
W<79.4 46
31
Test Orientation: 1 corner, 3 edges, 6 Faces.
After drop test, no abnormality on function /appearance.
Package Vibration
Test condition :
1. Sine wave:
5~200Hz 1.5G, 1 octave/min, 15 min dwell on each resonant
frequency, all primary axis, one sweep 30 minutes/Min. per
orientation, total of 90+ min.
2. Random wave:
5-100Hz, 0dB/Oct. 0.015(g
2
/Hz);
100-200Hz, -6dB/Oct. N/A
200Hz, N/A 0.0038(g
2
/Hz)
Equivalent to 1.47 Grms, all primary axes, 20 min
per-orientation, total of 60 min.
Note: Perform random vibration test before, the Sine-wave
Summary of Contents for Mainstream MP611
Page 32: ...32 Figure 1 Major Blemish Two Zone Screen Non Critical Zone Critical Zone center 25 ...
Page 43: ...43 Packing ...
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Page 61: ...61 Disassembly Assembly Exploded View ...
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Page 64: ...64 Disassembly Assembly ...
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Page 68: ...68 Level 1 Cosmetic Appearance Alignment Service Appearance ...
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Page 78: ...78 Overfill adjustment As the picture below adjust light pipe to keep overfill image center ...
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Page 90: ...90 Figure 4 6 Figure 4 9 ...
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Page 99: ...99 BKT Link Lamp Shield CW Figure9 3 Figure9 4 ...
Page 104: ...104 3 Example ...
Page 105: ...105 10 Mechanical Assembly Concerns ...
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Page 113: ...113 11 Power Assembly Concerns 1 Power board component add GP glue 1 1 CY604 CY605 add glue ...
Page 114: ...114 1 2 CY625 CY612 add glue ...
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Page 116: ...116 1 3 C651 R651 add glue 2 SW2 solder by operator ...
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Page 128: ...128 Chapter 3 Power Supply Trouble Shooting Guide 1 2 ...
Page 142: ...142 Bridge converts the AC input into DC output and the CAP is AC filter ...
Page 149: ...149 Circuit Schematics ...
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Page 152: ...152 PCB Artwork ...
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