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Appendix D
DMD Image Quality
1. SCOPE
This document specifies the image quality requirements applicable to the DLP
TM
.7XGA Value
Component Set. The Component Set provides the DLP
TM
.7XGA Value Projector with digital
imaging functionality based on Digital Micromirror Device (DMD) technology.
2. Definitions
2.1 Blemish
A blemish is an obstruction, reflection, or refraction of light that is visible, but out of
focus in the projected image under specified conditions of inspection (see Table 1). It
is caused by a particle, scratch, or other artifact located in the image illumination path.
2.2 Dark
pixel
A single pixel or mirror that is stuck in the OFF position and is visibly darker than the
surrounding pixels.
2.3 Bright
pixel
A single pixel or mirror that is stuck in the ON position and is visibly brighter than the
surrounding pixels.
2.4 Unstable pixel
A single pixel or mirror that does not operate in sequence with parameters loaded into
memory. The unstable pixel appears to be flickering asynchronously with the image.
2.5 Adjacent
pixel
Two or more stuck pixels sharing a common border or common point, also referred to
as a cluster.
2.6
Reset Boundary Artifact
The reset boundary artifact is a single row of pixels on the reset group boundaries that
are visibly darker or lighter than the neighboring rows of pixels.
Summary of Contents for Mainstream MP611
Page 32: ...32 Figure 1 Major Blemish Two Zone Screen Non Critical Zone Critical Zone center 25 ...
Page 43: ...43 Packing ...
Page 44: ...44 ...
Page 61: ...61 Disassembly Assembly Exploded View ...
Page 62: ...62 ...
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Page 64: ...64 Disassembly Assembly ...
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Page 68: ...68 Level 1 Cosmetic Appearance Alignment Service Appearance ...
Page 69: ...69 ...
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Page 78: ...78 Overfill adjustment As the picture below adjust light pipe to keep overfill image center ...
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Page 90: ...90 Figure 4 6 Figure 4 9 ...
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Page 99: ...99 BKT Link Lamp Shield CW Figure9 3 Figure9 4 ...
Page 104: ...104 3 Example ...
Page 105: ...105 10 Mechanical Assembly Concerns ...
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Page 113: ...113 11 Power Assembly Concerns 1 Power board component add GP glue 1 1 CY604 CY605 add glue ...
Page 114: ...114 1 2 CY625 CY612 add glue ...
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Page 116: ...116 1 3 C651 R651 add glue 2 SW2 solder by operator ...
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Page 128: ...128 Chapter 3 Power Supply Trouble Shooting Guide 1 2 ...
Page 142: ...142 Bridge converts the AC input into DC output and the CAP is AC filter ...
Page 149: ...149 Circuit Schematics ...
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Page 152: ...152 PCB Artwork ...
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