MVP3 ATX
SYSTEM BOARD
FEATURES
2-1
2.
FEATURES
2.1
MAINBOARD SPECIFICATIONS
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Chipset
VIA MVP3 (VT82C598MVP, VT82C586B) and Winbond W83877F / TF.
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CPU
Intel : Pentium
TM
processor and OverDrive processor
90 / 100 / 120 / 133 / 150 / 166 / 200 / 233 MHz.
Cyrix : 6x86 / 6x86L - P150+ / P166+ / P200+.
6x86MX - PR166 / PR200 / PR233,6x86MII - 266/300/333/366
IBM : 6x86MX - PR166 / PR200 / PR233 / PR266/PR300/PR333
AMD : K5 - PR90 / PR100 / PR120 / PR133 / PR150 / PR166.
K6-166 / 200 / 233 / 266 / 300
K6-2 -300 / 333 / 350 / 366 / 380 / 400 / 450.
K6-3 –400 / 450.
IDT
: Win Chip C6-180 / 200 / 225 / 240.
WinChip 2A – 200 / 233 / 266 / 300.
WinChip 3 – 266 / 300 / 333 / 350.
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CPU Voltage
(1).CPU I/O voltage
: “+3.3V DC” or ”+3.5V DC”.
(2).CPU CORE voltage : +1.3V DC ~ +3.5V DC.
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System Clock
60 / 66 / 75 / 83 / 95 / 100 MHz
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Memory
DRAM :Three banks, each bank can be single or double sided. Memory size up to
1GB. Supports SDRAM memory (use 168 pin DIMM module x 3).
Supports Parity / ECC (Error Checking and Correcting)
SRAM : 512KB or 1MB (optional) pipelined burst SRAM on board.
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BIOS
AWARD System BIOS. 128KB x 8 Flash ROM (for Plug & Play BIOS).