Avtech AVR-EB4-B, Instructions Manual, Page: 46 / 83

AVX-TRR-MELF, CHIP-LEVEL TESTS
Certain test jigs, including the AVX-TRR-MELF, accept chip-level packages.
These test jigs use spring-loaded flat-headed probe pins to contact the device under
test. The connection arrangement is the same as for the standard test jig. An example
of this arrangement is shown below:
AVX-TRR-STUD, DO-4 AND DO-5 STUD PACKAGES
Certain test jigs, such as the AVX-TRR-STUD, accept DO-4 AND DO-5 standard and
reverse-polarity stud packages. This test jig is shown below:
The photo below shows a reverse-polarity DO-4 diode (the Ruttonsha 12FLR60/F05)
installed between the four spring-loaded contacts (two for the anode end, and two for
the cathode end):
46
A chip DUT
sandwiched between
the two flat-headed
spring pins.