Advantech SOM-5993, User Manual

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3 SOM-5993 User Manual
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1.1 Introduction
The Advantech SOM-5993 leverages 128GB memory to support Intel
®
Xeon
®
10-
core processors in a 125 x 95 mm COM Express Basic module form factor. It offers a
wide spectrum of performance options enabling its users to configure the CPU and
RAM based on their system specifications. SOM-5993 is capable of full performance
without throttling when the SoC is at 69W TDP. This is achieved using Advantech’s
patented thermal solution — the Quadro Flow Cooling System (QFCS). SOM-5993
uses multiple TDP options (39 ~ 69W) to fulfill the needs of middle/high-end systems.
In addition, SOM-5993 features a reliable design that adapts to diverse applications.
It also features ruggedized SODIMM for improved vibration and shock resistance;
and supports TPM2.0 onboard chips for cyber-security. Likewise its wide power input
and temperature support (9 ~ 12V; -40 ~ 85 °C) is ideal for diverse applications. In
terms of software, SOM-5993 supports WISE-DeviceOn for remote hardware moni -
toring and over the air software updates.
SOM-5993 features 4 x screw holes near the CPU positioned in compliance with the
Intel
®
standard thermal design guide. The thermal module is attached to the CPU
using a balanced torque design. It is the first COM Express added a backplane to
increase the rigidity of the single board. This means that the thermal module makes
tight contact with the CPU without board bending. This results in highly-efficient heat
dissipation and outstanding computing performance. Advantech also offers SOM-
5993-thermal-solution pre-assembly services that make system-level assembly
easy.