ADLINK Technology DLAP-3200-CF Series, User Manual

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6 Specifications
I/O Interface
Display 6x DisplayPort (2 from CPU, 4 from MXM)
Ethernet 1x GbE (Intel® i219-LM), 3x GbE (Intel® i210-AT)
Serial Ports 1x RS-232/422/485, 1x RS-232
USB 6x USB 3.2 Gen1 x1 ports, 2x USB 2.0 ports
Audio Mic-in, L/R speaker-out (6W + 6W) (Optional)
M.2
X 1x M.2 E key for 1630 or 2230 Wi-Fi/BT module
X 1x M.2 B key for 2242 or 2280 SATA storage module
X 1x M.2 M key for 2242 or 2280 SATA/PCIe x4 storage module
eSIM Optional
DI/O 1x DI/DO with 4 in, 4 out
TPM 2.0 Yes
Expansion
2x PCIe Gen3 x4 expansion slots for full height, half length add-on card.
Each slot supports 25W power and additional Molex 4-pin power cable
(12V/1.5A and 5V/2A).
Storage
SATA
X 2x 2.5" SATA 6Gb/s external drive bays
X 2x SATA 6Gb/s signals via M.2 M & B key connectors
X Intel® RST RAID Support
Physical
Dimensions 235 x 182 x 129mm (W x D x H, without foot pads)
Mounting Optional wall-mount bracket
Power Supply
DC Input DC 12V input (Molex DC-in jack)
AC Input
X Optional: 240W (12V/20A) AC/DC adapter
X Optional: 500W (12V/41.7A) AC/DC power supply unit
Environmental
Operating
Temperature
0°C to 50°C (W/MXM module except RTX-5000, W/SSD; w/add on card supported
operating temperature is 0°C to 70°C)
0°C to 40°C (W/MXM RTX-5000, W/SSD, w/add on card supported operating
temperature is 0°C to 70°C)
Storage
Temperature
-20°C to 70°C
Humidity 5% to 95%, non-condensing
Model
DLAP-
3200-
CFP1
DLAP-
3200-
CFP2
DLAP-
3200-
CFT1
DLAP-
3200-
CFT3
DLAP-
3200-
CFT5
DLAP-
3200-
CFP3
DLAP-
3200-
CFP5
DLAP-3200-CFP12* DLAP-3200-CFP35*