ADLINK Technology DLAP-3000 Series, User Manual, Page: 11 / 141

Introduction 1
DLAP-3000/3100-CF
1 Introduction
1.1 Overview
The DLAP-3000/3100-CF series is an optimized computing plat-
form supporting performance-hungry workloads, such as deep
learning, with expandability options and active cooling for applica-
tions requiring very high levels of computing in a limited space.
The DLAP-3000/3100-CF series is one of the smallest embedded
GPU platforms (3.2 liters) with a low TDP reliable MXM GPU
design and scalable graphics processing ranging from Pascal to
Turing GPUs.
1.2 Features
X
ADLINK MXM Graphics module support (Type A/B, up to
120W)
X
8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processors
X
Dual SODIMMs for up to 64GB DDR4 non-ECC memory
(CPU dependent)
X
6x DisplayPort (2 from CPU, 4 from MXM)
X
1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth
module
X
1x M.2 B key supporting 2242 or 2280 for SATA storage
module
X
1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4
storage module (DLAP-3100 only)
X
Reliable Molex type 12V DC-in connector
X
1x Intel® i219-LM and 5x Intel® i210-AT (DLAP-3100 only)
X
1x Intel® i219-LM and 3x Intel® i210-AT (DLAP-3000 only)