www.xsens.com
18
Document MT1503P.A
© Xsens Technologies B.V.
Hardware Integration Manual MTi 1-series
6 Handling
6.1 Reflow specification
The moisture sensitivity level of the MTi 1-series modules corresponds to JEDEC MSL Level 3, see also:
IPC/JEDEC J-STD-020E “Joint Industry Standard: Moisture/Reflow Sensitivity Classification for
non-hermetic Solid State Surface Mount Devices”
IPC/JEDEC J-STD-033C “Joint Industry Standard: Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices”.
The sensor fulfils the lead-free soldering requirements of the above-mentioned IPC/JEDEC
standard, i.e. reflow soldering with a peak temperature up to 260 °C. Recommended Preheat Area (t
s
)
is 80-100 sec. The minimum height of the solder after reflow shall be at least 50 µm. This is required for
good mechanical decoupling between the MTi 1-series module and the printed circuit board (PCB) it is
mounted on.
The number of times that MEMS components may be reflowed is limited to three times. As the IMU is
already reflowed once by Xsens in order to produce the MTi 1-series module, the MTi 1-series module
may only be reflowed two times when placed on the PCB board. If the MTi 1-series is designed-in a
double-sided PCB, it is recommended to reflow the side with the MTi 1-series in the second run in order
to prevent large offsets.
For automated pick and placement of the MTi 1-series module please be aware that the component
placement on the module can differ between generations, see Table 9.
Figure 17: Reflow classification profile (not to scale)
6.2 Ultrasonic processes
The MTi 1-series is sensitive to ultrasonic waves (e.g.
ultrasonic cleaning/welding)
, which
will
damage the MTi-1 series module
. Xsens will offer no warranty against damaged MTi 1-series modules
caused by any ultrasonic processes.
Do not expose the MTi 1-series to ultrasonic processes!
