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Document MT1503P.A
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Hardware Integration Manual MTi 1-series
4.4 Footprint
The footprint of the MTi 1-series module is similar to a 28-lead Plastic Leaded Chip Carrier package
(JEDEC MO-047). Although it is recommended to solder the MTi 1-series module directly onto a PCB,
it can also be mounted in a compatible PLCC socket (e.g. 8428-21B1-RK of M3, as used on the MTi 1-
series Development Kit). When using a socket, make sure that it supports the maximum dimensions of
the MTi 1-series module as given in Section 5.3 (note the tolerance of ± 0.1 mm).
Figure 13: Recommended MTi 1-series module footprint
