WIFI-LPT100-B User Manual
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2.6 Package Information
Recommended Reflow Profile
Note:
1. Recommend to supply N2 for reflow oven.
2. N2 atmosphere during reflow (O2<300ppm)
2.7 Device Handle Instruction
➢
Shelf life in sealed bag: 12 months, at <30
℃
and <60% relative humidity
(RH)
➢
After bag is opened, devices that will be re-baked required after last
baked with window time 168 hours.
➢
Recommend to oven bake with N2 supplied.
➢
Baked required with 24 hours at 125±5
℃
before rework process for two
modules, one is new module and two is board with module.
➢
Recommend to store at
≦
10% RH with vacuum packing.
➢
If SMT process needs twice reflow:
(1) Top side SMT and reflow (2) Bottom side SMT and reflow
Case 1: WIFI module mounted on top side. Need to bake when bottom
side process over 168 hours window time, no need to bake within 168
hours.
Case 2: WIFI module mounted on bottom side, follow normal bake rule
before process.
Note:
Window time means from last bake end to next reflow start that has 168
hours space.
Figure 8 Reflow Soldering Profile