16
Device Description
WAGO-I/O-SYSTEM 750
750-402 4DI 24V DC 3.0ms
Manual
Version 1.1.0
Pos : 25 /All e Seri en (Allgemei ne Module)/Ü berschrif ten f ür alle Serien/G erätebesc hreibung/Ansc hlüsse - Übersc hrift 2 @ 4\ mod_1240984262656_21. doc x @ 31961 @ 22 @ 1
3.2
Connectors
Pos : 26 /Serie 750 ( WAGO-I/ O-SYST EM)/ Ger ät ebesc hrei bung/Ansc hl üss e/Datenkontakt e/Kl emmenbus - Ü bersc hrift 3 @ 6\ mod_1256294684083_21.doc x @ 43660 @ 3 @ 1
3.2.1
Data Contacts/Internal Bus
Pos : 27.1 /Serie 750 (WAGO-I/ O-SYST EM)/ Ger ätebesc hrei bung/Ansc hl üsse/Datenkontakt e - F eldbus koppler/-c ontroll er, Abbildung und Besc hrei bung @ 3\mod_1231771259187_21.doc x @ 26002 @ @ 1
Communication between the coupler/controller and the I/O modules as well as the
system supply of the I/O modules is carried out via the internal bus. It is
comprised of 6 data contacts, which are available as self-cleaning gold spring
contacts.
Figure 2: Data contacts
Pos : 27.2 /Serie 750 (WAGO-I/ O-SYST EM)/ Wic htige Erläut erungen/ Sicherheits- und sonstig e Hinweis e/ Achtung/Achtung: Bus kl emmen nic ht auf G oldf eder kontakt e leg en! @ 7\ mod_1266318463636_21. doc x @ 50695 @ @ 1
Do not place the I/O modules on the gold spring contacts!
Do not place the I/O modules on the gold spring contacts in order to avoid soiling
or scratching!
Pos : 27.3 /Serie 750 (WAGO-I/ O-SYST EM)/ Wic htige Erläut erungen/ Sicherheits- und sonstig e Hinweis e/ Achtung/Achtung: ESD - Auf g ut e Erdung der U mgebung ac ht en! @ 7\ mod_1266318538667_21. doc x @ 50708 @ @ 1
Ensure that the environment is well grounded!
The modules are equipped with electronic components that may be destroyed by
electrostatic discharge. When handling the modules, ensure that the environment
(persons, workplace and packing) is well grounded. Avoid touching conductive
components, e.g. data contacts.
Pos : 28 /D okument ation allgemei n/ Glieder ungs elemente/---Seit enwechs el--- @ 3\ mod_1221108045078_0. doc x @ 21810 @ @ 1
