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Carrier Board Design Guide for SOM-9X35 Module
5
2.1.1 6-Layer PCB Stack-up Example
The following figure shows the recommended 6-layer PCB stack-up design for the carrier board of the VIA SOM-
9X35 module.
Core = 4.0mil (Er = 4.1)
PP =4.3 (Er = 4.2)
Solder mask = 0.4mil (Er=3.5)
Pla�ng = 0.8mil
LAYER 1
LAYER 2
LAYER 3
LAYER 4
63.4mil
TOP = 0.5oz (0.8mil)
Copper foil + Plating
GROUND1 = 1.0oz (1.2mil)
Copper foil
PP = 42mil (Er =4.4)
(adjustable)
INNER1 = 1.0oz (1.2mil)
Copper foil + Plating
Core = 4.0mil (Er = 4.1)
PP = 4.3mil (Er = 4.2mil)
LAYER 5
LAYER 6
GROUND2=1.0oz (1.2mil)
Copper foil
BOTTOM = 0.5 oz (0.8mil)
Solder mask = 0.4mil (Er = 3.5)
Pla�ng = 0.8mil
Copper foil + Plating
INNER2 = 1.0oz (1.2mil)
Copper foil
Figure 04:
6-Layer PCB board stack-up detail
2.1.2 Impedance Requirements
Function Type
Other
Signal
USB
MIPI DSI
MIPI CSI
HDMI
LVDS
Ethernet
Trace Type
Single-
ended
Differential Differential Differential Differential Differential Differential
Required value
50Ω
90Ω
100Ω
100Ω
100Ω
100Ω
100Ω
Trace & Spacing (mil)
(W:S:W)
Micro strip
7
6.1 : 5.6 :
6.1
5.6: 8.3 :
5.6
5.6: 8.3 :
5.6
5.6: 8.3 :
5.6
5.6: 8.3 :
5.6
5.6: 8.3 :
5.6
Trace & Spacing (mil)
(W:S:W)
Strip line
5
4.4 : 6.4 :
4.4
3.9 : 9.1 :
3.9
3.9 : 9.1 :
3.9
3.9 : 9.1 :
3.9
3.9 : 9.1 :
3.9
3.9 : 9.1 :
3.9
Table 03:
Impedance requirements