Ublox TOBY-L2 series, Руководство по системной интеграции

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TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R28 Design-in Page 98 of 164
Guidelines for single SIM chip connection
A solderable SIM chip (M2M UICC Form Factor) must be connected the SIM card interface of
TOBY-L2 and MPCI-L2 series modules as described in
Figure 51 .
Follow these guidelines to connect the module to a solderable SIM chip without SIM presence
detection:

Connect the UICC / SIM contacts C1 (VCC) to the VSIM / UIM_PWR pin of the module.
 Connect the UICC / SIM contact C7 (I/O) to the SIM_IO / UIM_DATA pin of the module.
 Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK / UIM_CLK pin of the module.
 Connect the UICC / SIM contact C2 (RST) to the SIM_RST / UIM_RESET pin of the module.
 Connect the UICC / SIM contact C5 (GND) to ground.
 Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line close to
the relative pad of the SIM chip, to prevent digital noise.
 Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM
line, to prevent RF coupling especially in case the RF antenna is placed closer than 10 – 30 cm from
the SIM lines.
 Limit capacitance and series resistance on each SIM signal to match the SIM requirements (26.2
ns is the maximum allowed rise time on clock line, 1.0
µ
s is the maximum allowed rise time on data
and reset lines).
1:1 scaling
TOBY-L2 series
59
VSIM
57
SIM_IO
56
SIM_CLK
58
SIM_RST
SIM CHIP
SIM Chip
Bottom View
(contacts
side)
C1
VPP (C6)
VCC (C1)
IO (C7)
CLK (C3)
RST (C2)
GND (C5)
C2 C3 C5
U1
C4
2
8
3
6
7
1
C1 C5
C2 C6
C3 C7
C4 C8
8
7
6
5 1
2
3
4
MPCI-L2 series
8 UIM_PWR
10
UIM_DATA
12
UIM_CLK
14
UIM_RESET
SIM CHIP
SIM Chip
Bottom View
(contacts
side)
C1
VPP (C6)
VCC (C1)
IO (C7)
CLK (C3)
RST (C2)
GND (C5)
C2 C3 C5
U1
C4
2
8
3
6
7
1
C1 C5
C2 C6
C3 C7
C4 C8
8
7
6
5 1
2
3
4
Figure 51: Application circuits for the connection to a single solderable SIM chip, with SIM detection not implemented
Reference Description Part Number – Manufacturer
C1, C2, C3, C4 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 – Murata
C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 – Murata
U1 SIM chip (M2M UICC Form Factor) Various Manufacturers
Table 31: Example of components for the connection to a single solderable SIM chip, with SIM detection not implemented