Texas ths6022, Руководство пользователя

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Running Title—Attribute Reference
vi
Figures
1–1 THS6022 Evaluation Module 1-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–2 THS6022 Evaluation Module Schematic 1-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–3 THS6022 Evaluation Module Block Diagram 1-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–4 THS6022 EVM Driver Frequency Response With a 50-W Load 1-7 . . . . . . . . . . . . . . . . . . . . .
1–5 THS6022 EVM Driver Frequency Response Test Circuit 1-7 . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–6 PowerPAD PCB Etch and Via Pattern – Minimum Requirements 1-9 . . . . . . . . . . . . . . . . . . . .
1–7 Maximum Power Dissipation vs. Free-Air Temperature 1-10 . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–1 THS6022 EVM Component Placement Silkscreen and Layout 2-3 . . . . . . . . . . . . . . . . . . . . . .
2–2 THS6022 EVM PC Board: Layer 1 — Top Side Layout 2-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–3 THS6022 EVM PC Board: Layer 2 — Back Side Ground Plane Layer 2-4 . . . . . . . . . . . . . . . .
2–4 THS6022 EVM PC Board: Solder Mask — Back Side 2-4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .