Texas ths6022, Руководство пользователя

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General PowerPAD Design Considerations
1-11 General Information
Even though the THS6022 EVM PCB surface area is larger than the one in the
example above, the results should correlate very well because the traces and
the vias of the EVM PCB interrupt the thermal continuity of the ground plane.
The THS6022 EVM is a good example of proper thermal management when
using PowerPAD-mounted devices.
Correct PCB layout and manufacturing techniques are critical for achieving
adequate transfer of heat away from the PowerPAD IC package. More details
on proper board layout can be found in the
THS6022 250-mA DUAL
DIFFERENTIAL LINE DRIVER data sheet (SLOS225). For more general
information on the PowerPAD package and its thermal characteristics, see the
Texas Instruments Technical Brief,
PowerPAD Thermally Enhanced Package
(SLMA002).