Technical Data
Service Manual
P5000HX(-M)-WMB Series Motherboard
29
Figure 10
The P5000HX(-M)-WMB Series Motherboard
A Note on Thermal Specifications
The technology and power density of the microprocessor is rapidly increasing. The 80386 required less than a few
hundred milliamps of current. The 80486DX4 peaked at less than 1.5 A and typically dissipated less than 5 W of power.
The 233 MHz Pentium
®
processor with MMX™ technology requires up to 6.5 A and dissipates as much as 17 W. Power
levels have finally increased to a level that greatly affects the ability of the equipment to effectively dissipate energy.
Texas Micro is continually working to ensure that its products will conform to thermal specifications. However, we can
only work within known or anticipated hardware and software configurations. One peripheral device installed within a
chassis can significantly alter operating temperature. Also, software applications can cause as much as 20 °C variation.
Even the cable layout within the chassis can affect airflow and thereby performance.
Texas Micro validates the operating specifications of its products by testing with the “hottest” possible hardware and
software configuration, that will maximize the power supply draw and generate a worst-case scenario. However, despite
these efforts, the specifications are only benchmarks and should be regarded as such.
The CPU requires a minimum airflow of 200 linear feet per minute (LFM) unimpeded across the
processor within 0 to 55 °C (32 to 131 °F) ambient temperature. Operations outside these
specifications could void the warranty.
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