1 Introduction
The TMDS64DC01EVM (AM64x EVM IO-Link and High Speed Expansion Board) and TMDS243DC01EVM
(AM243x EVM High Speed Expansion Board) are add-on modules for the AM64x and AM243x EVMs. These
boards include two sections: namely an IO-Link section supporting eight (8) IO-Link ports and a general purpose
signal breakout section.
The AM64x version of this board enables both the IO-Link and general purpose breakout sections, while the
AM243x version of this board only supports the general purpose breakout functionality.
Table 1-1. TMDS64DC01EVM and TMDS243DC01EVM Feature Comparison
Feature
TMDS64DC01EVM
TMDS243DC01EVM
IO-Link section
Yes
No (not populated)
General purpose signal breakout section
Yes
Yes
The general purpose breakout section provides test points to all IO signals included on the High Speed
Expansion (HSE) connector from AM64x and AM243x EVM.
The IO-Link section enables development of PLC and Remote I/O IO-Link master applications by providing
eight M12 IO-Link connectors to help build a universal and scalable IO-Link master. IO-Link (International
Electrotechnical Commission [IEC] 61131-9) is an open standards protocol that addresses the need for
intelligent control of small devices such as sensors and actuators. This standard provides low-speed point-to-
point serial communication between a device and a master that normally serves as a gateway to a fieldbus
and PLC. The intelligent link established enables ease of communication for data exchange, configuration, and
diagnostics.
An unshielded three-wire cable as long as 20 meters, normally equipped with M12 connectors, establishes an
IO-Link connection. Data rates range up to 230 kbps with a nonsynchronous minimum cycle time of 400 μs,
+10%. Four operating modes support bidirectional input/output (I/O), digital input, digital output and deactivation.
Security mechanisms and deterministic data delivery are not specified. A profile known as the IO Device
Description (IODD) contains communication properties; device parameters; identification, process and diagnostic
data; and information specifically about the device and manufacturer.
The many advantages of an IO-Link system include standardized wiring, increased data availability, remote
monitoring and configuration, simple replacement of devices and advanced diagnostics. IO-Link permits factory
managers to receive sensor updates and plan for upcoming maintenance or replacement. Swapping out a
sensing or actuation unit that needs replacement and configuring a new one from the PLC through the IO-Link
master eliminates manual setup and reduces downtime. Switching production remotely from one configuration
to another without visiting the factory floor facilitates easier product customization. Factories can upgrade
production lines readily to IO-Link, since it is backwards-compatible with existing standard I/O installations and
cabling. Altogether, these capabilities result in reduced overall costs, more efficient processes, and greater
machine availability.
Introduction
2
TMDS64DC01EVM and TMDS243DC01EVM User's Guide
SPRUJ06 – OCTOBER 2021
Copyright © 2021 Texas Instruments Incorporated
