Texas Instruments TMDS243DC01EVM, Руководство пользователя

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3.3 Interfaces and Major Component Description
The following sections provide an overview of the different interfaces and circuits on the TMDS64DC01EVM and
TMDS243DC01EVM.
3.3.1 Breakout Board Section
The general purpose Breakout board connects each pin of the High Speed Expansion (HSE) connector to eight,
2x10 test headers with 0.1” spacing between each pin. Additionally, the board features a circuit prototype area
with standard 0.1” hole spacing.
Signals from the HSE connector are connected to the Breakout board or IO-Link section using FET switches.
The FET switches are controlled using the J11 Header. Connecting the control signal of all the MUXes to ground
routes all signals from the HSE connector to the Breakout board, whereas connecting the control signal to
VCC3V3_IO_HSE routes all signals from the Mux to the IO-Link section.
Table 3-2. Functionality Selected by J11 Header
J11 Header Selection Functionality Supported Board
Short J11 pins 1 and 2 Selects IO-Link section TMDS64DC01EVM only
Short J11 pins 2 and 3 Selects Breakout board section TMDS64DC01EVM and TMDS243DC01EVM
Figure 3-3. Breakout Sectional Functional Block Diagram
System Description www.ti.com
6 TMDS64DC01EVM and TMDS243DC01EVM User's Guide SPRUJ06 – OCTOBER 2021
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