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MSP430G2533, MSP430G2433, MSP430G2333, MSP430G2233
MSP430G2403, MSP430G2303, MSP430G2203
SLAS734G – APRIL 2011 – REVISED APRIL 2016
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MSP430G2533 MSP430G2433 MSP430G2333 MSP430G2233 MSP430G2403 MSP430G2303
MSP430G2203
Specifications
Copyright © 2011–2016, Texas Instruments Incorporated
(1)
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC (R
θ
JC
) value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment and application. For more information, see these EIA/JEDEC
standards:
•
JESD51-2,
Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
•
JESD51-3,
Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-7,
High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-9,
Test Boards for Area Array Surface Mount Package Thermal Measurements
(2)
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3)
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4)
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
5.8
Thermal Resistance Characteristics
PARAMETER
VALUE
(1)
UNIT
R
θ
JA
Junction-to-ambient thermal resistance, still air
(2)
VQFN (RHB-32)
32.1
°C/W
TSSOP (PW-28)
72.2
TSSOP (PW-20)
86.5
PDIP (N-20)
49.3
R
θ
JC(TOP)
Junction-to-case (top) thermal resistance
(3)
VQFN (RHB-32)
22.3
°C/W
TSSOP (PW-28)
18.3
TSSOP (PW-20)
20.8
PDIP (N-20)
41
R
θ
JC(BOTTOM)
Junction-to-case (bottom) thermal resistance
VQFN (RHB-32)
1.4
°C/W
TSSOP (PW-28)
N/A
TSSOP (PW-20)
N/A
PDIP (N-20)
N/A
θ
JB
Junction-to-board thermal resistance
(4)
VQFN (RHB-32)
6.1
°C/W
TSSOP (PW-28)
30.4
TSSOP (PW-20)
39
PDIP (N-20)
30.2
Ψ
JT
Junction-to-package-top characterization parameter
VQFN (RHB-32)
0.3
°C/W
TSSOP (PW-28)
0.7
TSSOP (PW-20)
0.8
PDIP (N-20)
18.1
Ψ
JB
Junction-to-board characterization parameter
VQFN (RHB-32)
6.1
°C/W
TSSOP (PW-28)
29.9
TSSOP (PW-20)
38.1
PDIP (N-20)
30.1