©2012 Terumo BCT, Inc.
Page 4 of 14
PN 306620452
Operating Procedures
Setting Up the Device
Step Action
1
The TSCD II device includes a cover and two bag support shelves.
Verify that the cover is either in the open position or removed
from the device. Refer to “Removing and Attaching the Cover” on
page 8.
Verify that the bag support shelves are attached to the device. If
not, attach them according to the instructions in “Assembling and
Attaching the Bag Support Shelves” on page 8.
2
Connect the power cord to the AC inlet at the back of the TSCD II device,
and plug the power cord into a grounded outlet.
3
Empty the wafer disposal box.
a. Pull on the insert on the front of the wafer disposal box to loosen
it from the TSCD II device.
b. Slide the box forward to remove it from the device.
c. Discard the used wafers into an appropriate container.
Caution:
Wafers that have been used on tubing that contained blood
products should be considered biohazardous waste and should be
handled appropriately, according to your institution's SOPs.
4
Insert a wafer cassette (cartridge) if one is not already in place.
5
Turn the power switch located at the back of the device to the On
position. After you turn on the device:
The fan starts.
The device beeps.
The LCD display illuminates, and the device completes a self
check. Refer to Section 5.2 in the operating instructions for
information displayed during the self check.
The wafer is being heated to 70 °C to shorten weld time. The
message
HOLDER WARM UP
shows on the LCD display, and
the device beeps when it is ready for operations. (It takes
approximately 3 minutes to warm the wafer holder to 70 °C when
the device is at room temperature.)
