HW User Guide
1vv0301018 Rev. 15
Page
7
of
72
2019-01-07
11.8.2.
Frequency Behavior .................................................................... 51
11.8.3.
Power
Supply Influence
................................................................ 51
11.8.4.
Working Current Influence .......................................................... 52
STAT LED Indication of network service availability .................... 52
SIMIN detect function.................................................................. 53
RTC Bypass out .......................................................................... 53
SIM Holder Implementation ........................................................ 53
12.
DAC AND ADC SECTION .......................................................... 54
DAC Converter ........................................................................... 54
12.1.1.
Description .................................................................................. 54
12.1.2.
Enabling DAC ............................................................................. 55
12.1.3.
Low Pass Filter Example ............................................................ 55
ADC Converter ........................................................................... 56
12.2.1.
Description .................................................................................. 56
12.2.2.
Using ADC Converter ................................................................. 56
13.
MOUNTING THE GL865 V3/V3.1 ON YOUR BOARD ............... 57
General ....................................................................................... 57
Module finishing & dimensions .................................................... 57
Recommended foot print for the application ................................ 58
Stencil ......................................................................................... 59
PCB pad design .......................................................................... 59
Recommendations for PCB pad dimensions (mm): ..................... 59
Solder paste ............................................................................... 60
GL865 V3/V3.1 Solder reflow ...................................................... 61
Debug of the GL865 V3/V3.1 in production ................................. 62
14.
PACKING SYSTEM ................................................................... 63
Packing on tray ........................................................................... 63
Packing on reel ........................................................................... 65
14.2.1.
Carrier tape detail ....................................................................... 66
14.2.2.
Carrier detail ............................................................................... 66
Moisture sensibility ..................................................................... 67
15.
CONFORMITY ASSESSMENT ISSUES .................................... 68
16.
SAFETY RECOMMENDATIONS................................................ 70
17.
DOCUMENT HISTORY .............................................................. 71
Содержание GL865 V3
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