HW User Guide
1vv0301018 Rev. 15
Page
28
of
72
2019-01-07
6.3.2.
Thermal Design Guidelines
The thermal design for the power supply heat sink should be done with the following
specifications:
See Par.
6.2
Power Consumption
NOTE:
The average consumption during transmissions depends on the power
level at which the device is requested to transmit by the network. The
average current consumption hence varies significantly.
Considering the very low current during idle, especially if Power Saving function is enabled,
it is possible to consider from the thermal point of view that the device absorbs current
significantly only during calls.
For the heat generated by the GL865 V3/V3.1, you can consider it to be during transmission
1W max during CSD/VOICE calls and 2W max during class10 GPRS upload.
This generated heat will be mostly conducted to the ground plane under the GL865 V3/V3.1;
you must ensure that your application can dissipate it.
Содержание GL865 V3
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