DE910 Series Hardware User Guide
1vv0300951 Rev.9 – 2015-05-11
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Reserved. Page 7 of 77
11.1.2.
Enabling DAC .............................................
58
11.1.3.
Low Pass Filter Example ..................................
59
11.2.
ADC Converter .......................................... 59
11.2.1.
Description ..............................................
59
11.2.2.
Using ADC Converter ......................................
59
12.
Test Point .................................................. 60
13.
Mounting the Module on your Board ........................... 61
13.1.
General ................................................ 61
13.2.
Module Finishing & Dimensions .......................... 61
13.3.
Recommended foot print for the application ............. 62
13.4.
Stencil ................................................ 63
13.5.
PCB Pad Design ......................................... 63
13.6.
Recommendations for PCB Pad Dimensions (mm) ............ 63
13.7.
Solder Paste ........................................... 65
13.7.1.
Solder Reflow ............................................
65
14.
Packing System .............................................. 67
14.1.
Tray ................................................... 67
14.2.
Reel ................................................... 69
14.2.1.
Carrier Tape Detail ......................................
69
14.2.2.
Reel Detail ..............................................
70
14.2.3.
Packaging Detail .........................................
70
14.3.
Moisture Sensibility ................................... 71
15.
Application Design Guide .................................... 72
15.1.
Download and Debug Port ................................ 72
16.
Conformity Assessment Issues (Problèmes d'évaluation de
conformité)...................................................... 73
17.
Safety Recommendations ...................................... 76
18.
Document History ............................................ 77