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DE910 Series Hardware User Guide
1vv0300951 Rev.9 – 2015-05-11
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13.7.
Solder Paste
Solder Paste
Lead free
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.
13.7.1.
Solder Reflow
The following is the recommended solder reflow profile:
Profile Feature
Pb-Free Assembly
Average ramp-up rate (T
L
to T
P
)
3
℃
/second max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
150
℃
200
℃
60
~ 180 seconds
Tsmax to TL
- Ramp-up Rate
3
℃
/second max
Time maintained above:
- Temperature (TL)
- Time (tL)
217
℃
60 ~150 seconds