
Teledyne LeCroy
PCI Express Mid-Bus Probe for Summit Analyzers
Version 1.1
21
4. Turn the board over to ensure that the pins from the module end are visible and accessible on the
bottom surface of the board. Note: the pins of the Universal Gen2 Retention Module are
intended to accommodate PCB thicknesses up to 125 mils (3.175 mm).
5. With the module held firmly against the front surface of the board, solder the two pins into
position, allowing solder to wick down into the solder hole. When the solder has set, trim the
excess length of the pin flush with the board surface.
6. Turn the board right-side up, and align and inert the second module end into the opposite end of
the footprint.
7. Repeat steps 4 and 5 for soldering the second module end.