FLEX-IMX8M-Mini HARDWARE MANUAL
– VER 1.00 – JAN 31 2020
Page
8
of
48
3. Core Components
3.1. NXP i.MX8M Mini ARM Cortex-A53 + Cortex-M4 Processor
The i.MX 8M Mini
is NXP’s first embedded multicore applications processor built using advanced
14LPC FinFET process technology, providing more speed and improved power efficiency. With
commercial and industrial level qualification and backed by NXP’s product longevity program, the i.MX
8M Mini family may be used in any general purpose industrial and IoT application.
For additional details, please refer to the
“i.MX8M Mini Applications Processor Reference Manual”.
The i.MX8M Mini has the following features :
•
Multicore Processing
o
4x Cortex-A53 core platforms up to 1.8GHz per core
o
32KB L1-I Cache/ 32 kB L1-D Cache
o
512 kB L2 Cache
o
1x Arm Cortex-M4 core up to 400MHz
o
16 kB L1-I Cache/ 16 kB L2-D Cache
•
GPU
o
3D GPU (1x shader, OpenGL ES 2.0)
o
2D GPU
•
Display Interface
o
1x MIPI DSI (4-lane) with PHY
•
Video Playback
o
1080p60 VP9 Profile 0, 2 (10-bit) decoder, HEVC/H.265 decoder, AVC/H.264
Baseline, Main, High decoder, VP8 decoder
o
1080p60 AVC/H.264 encoder, VP8 encoder
•
Audio
o
5x SAI (12Tx + 16Rx external I2S lanes), 8ch PDM input
•
Camera Interface
o
1x MIPI CSI (4-lane) with PHY
•
USB
o
2x USB 2.0 OTG controllers with integrated PHY
•
PCIe
o
1x PCIe 2.0 (1-lane) with L1 low power sub states
•
Ethernet
o
1x Gigabit Ethernet (MAC) with AVB and IEEE 1588, Energy Efficient Ethernet (EEE)
for low power
•
Operating Systems
o
Linux, Android, FreeRTOS
•
Temperature
o
Consumer (0°C to 95°C Tj)
o
Industrial (-40°C to 105°C Tj)
•
Package
o
FCBGA, 14x14 0.5mm pitch
