FLEX-IMX8M-Mini HARDWARE MANUAL
– VER 1.00 – JAN 31 2020
Page
11
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3.3. Memory
The FLEX-IMX8M-Mini integrates Low Power Double Data Rate IV (LPDDR4) Synchronous DRAM is
connected over a 32-Bit dual channel configuration. (16 bit per channel).
The following memory chip manufacturers have been validated and tested on the FLEX-IMX8M-Mini
Compute Module:
•
SKHynix
•
Kingston
•
Micron
•
Samsung
•
ISSI
3.4. eMMC Storage
The FLEX-IMX8M-Mini can be ordered with onboard eMMC storage in different configurations and
capacity. The onboard eMMC device is connected on the USDHC3 pins of the i.MX8M Mini processor
in an 8-bit width configuration.
The following eMMC chip manufacturers have been validated and tested on the FLEX-IMX8M-Mini
System-on-Module:
•
Kingston eMMC
•
Micron eMMC
•
Sandisk iNAND
Table 4
– eMMC Signal Description
CPU
BALL
CPU PAD NAME
Signal
V
I/O Description
M26
NAND_DATA04
USDHC3_DATA0
1V8 I/O MMC/SDIO Data bit 0
L26
NAND_DATA05
USDHC3_DATA1
1V8 I/O MMC/SDIO Data bit 1
K26
NAND_DATA06
USDHC3_DATA2
1V8 I/O MMC/SDIO Data bit 2
N26
NAND_DATA07
USDHC3_DATA3
1V8 I/O MMC/SDIO Data bit 3
N27
NAND_RE_B
USDHC3_DATA4
1V8 I/O MMC/SDIO Data bit 4
M27
NAND_CE2_B
USDHC3_DATA5
1V8 I/O MMC/SDIO Data bit 5
L27
NAND_CE3_B
USDHC3_DATA6
1V8 I/O MMC/SDIO Data bit 6
K27
NAND_CLE
USDHC3_DATA7
1V8 I/O MMC/SDIO Data bit 7
R27
NAND_WP_B
USDHC3_CMD
1V8 I/O MMC/SDIO Command
R26
NAND_WE_B
USDHC3_CLK
1V8
O
MMC/SDIO Clock
P27
NAND_CE1_B
USDHC3_STROBE
1V8
O
This signal is generated by the device
and used for output in HS400 Mode
