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Technical specifications
66
DB6 Single / Multi / AES – Firmware version 1.30
Technical specifications
DB6 Frame
General
Frame configuration:
DB6 Single holds 1 Transmission 3G card
DB6 Multi holds 1 to 3 Transmission 3G cards
Front indicators:
Status for: PSU 1, PSU 2, Sync, Alert, Signal
Finish:
Natural color anodized aluminum face plate. Plated steel
chassis
Dimensions:
19 x 1.75 x 13.2 inches (483 x 44 x 334 mm), 1 RU
Weight – DB6 Single
9.5 lbs. (4.3 kg)
Weight – DB6 Multi
max 10.4 lbs. (4.7 kg)
Mains voltage:
100 to 240 VAC, 50-60 Hz auto-select
Power supply function:
Dual Power Supply Redundancy
Fan:
Dual Fan Redundancy
Power consumption:
DB6 Single 14 W typ., DB6 Multi 45 W typ
Warranty, Parts and labor:
2 years (Extended Warranty program available)
EMC
Complies with:
EN 55103-1 and EN 55103-2, FCC part 15 class B, CIS-
PR 22 class B
Safety
Certified to:
IEC 60065, EN 60065, UL 6500 and CSA E65
Environment
Operating Temperature:
32° F to 122° F (0° C to 50° C)
Storage Temperature:
-22° F to 167° F (-30° C to 70° C)
Humidity:
Max. 90 % non-condensing
Transmission 3G Card
General
Number of Processors:
Two LoudnessWizard processors, Stereo or 5.1
Number of Meters:
Two LM6 Loudness Radar Meters. Stereo or 5.1
Number of audio channels processed:
8 in, 8 out (pr. card)
Audio format configuration:
2, 5.1, 2+2, 5.1+2, 2+5.1, 5.1+5.1
Audio Processing Delay:
0.15 ms
Adjustable On-line Delay:
0-10 sec per audio channel
Delay Resolution:
32 bit
Frequency Response DIO:
DC to 23.9 kHz +/- 0.01 dB
Audio sample rate:
48 kHz, fully synchronous
Audio Processing Resolution:
32 bit, bit-transparent
Содержание DB6
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