Tait TB7100, Руководство по обслуживанию

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106 Disassembly and Reassembly TB7100 Service Manual
© Tait Electronics Limited October 2005
3. If the thermal paste on the heatsink
1!
or the tin-plated cooper plate
of the board has been contaminated, new thermal paste must be
applied:
■
Remove any residue of the old thermal paste from both contact
surfaces.
■
Use Dow Corning 340 silicone heat-sink compound
(IPN 937-00000-55).
Important
Ensure that no bristles from the brush come loose and
remain embedded in the paste. The paste needs to be
completely free of contaminants.
■
Use a stiff brush to apply 0.1cm
3
of thermal paste over the
complete contact surface on the tin-plated copper plate (refer to
Figure 7.6 on page 105 ).
Important
With the 50 W/40 W board, the rectangular gap pad
j
must not overlap the edge of the tin-plated copper plate
(refer to
Figure 7.6 on page 105 ).
4. Place the board in position on the heatsink
1!
, and push them
together to spread the thermal paste.
5. Place three screws
g
into the holes above the metal heatsink plate by:
a. holding the module at a 60° angle
b. fitting the screw on the Torx driver
c. slipping it through the shield hole and into the PCB hole
6. Use a Torx T10 torque-driver to fasten the three screws
g
to 15lbf·in
(1.7N·m).
7. Use a Torx T10 torque-driver to fasten the four screws
f
to 4.5lbf·in
(0.5N·m).