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17
Chapter 1: Introduction
Motherboard Features
Other
•
RoHS
Dimensions
•
Micro ATX form factor (9.6" x 9.6") (243.84 mm x 243.84 mm)
Note 1:
The CPU maximum thermal design power (TDP) is subject to chassis and
heatsink cooling restrictions. For proper thermal management, please check the chas-
sis and heatsink specifications for proper CPU TDP sizing.
Note 2:
For IPMI configuration instructions, please refer to the Embedded IPMI Con
-
figuration User's Guide available at http://www.supermicro.com/support/manuals/.