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Appendix B: System Specifications
Appendix B
System Specifications
Processors
3rd Gen Intel Xeon Scalable processors in a P+ (LGA-4189) socket with up to 40 cores and a thermal design power (TDP) of
up to 270W
Chipset
Intel PCH C621A
BIOS
256Mb AMI BIOS SPI Flash
Memory
Up to 2TB of ECC RDIMM/LRDIMM/LRDIMM 3DS with speeds up to 3200MHz in eight slots; DIMM size Up to 256GB at 1.2V
Storage Drives
Forty-five 3.5" hot-swap SATA/SAS bays
Two rear 2.5" hot-swap drives, SATA
(
Optional
) Two rear 2.5" hot-swap SATA or NVMe bays
One M.2 SSD, PCIe 3.0 x4/SATA3 slot, M-Key 2280/22110
Two SATADOMs (disk on module)
PCI Expansion Slots
Two PCI-Express 4.0 x16 low profile
Two PCI-Express 4.0 x8 low profile (one in a x16 slot)
Input/Output
LAN: Two 10G BASE-T; one dedicated BMC port
USB: Two USB 2.0 ports
Two USB 3.2 Gen 1 ports
One VGA port
Motherboard
X12SPI-TF; 12.1" (L) x 10" (W) (307.34mm x 254mm)
Chassis
946LEIC-R1K66LPB; 4U Rackmount, 17.2 x 7.0 x 26 in. / 437 x 178 x 660 mm. (W x H x D)
System Cooling
Five 8-cm heavy duty fans with Optimal Fan Speed Control
One air shroud; one CPU heatsink
Power Supply
Model: PWS-1K66A-1R, 1600W redundant modules, 80Plus Platinum level
Total Output Power: 1000 W/1600 W
Input:
100-127 Vac / 12.9 A Max / 50-60 Hz
200-240 Vac / 9.5 A Max / 50-60 Hz
Rated Output Power:
+12 V
Max: 82 A / Min: 0.1 A (100-127 Vac)
Max: 132 A / Min: 0.1 A (200-240 Vac)
1 2 V SB Max: 2 A / Min: 0. 2 A