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4-14
HDVF-C35W
(RE-249 BOARD)
Ref. No.
or Q'ty Part No. SP Description
C60 1-112-691-11 s CAP, CERAMIC 22MF R 3225
C61 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C62 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C63 1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C64 1-125-827-91 s CAP, CHIP CERAMIC 1MF B
C67 1-125-827-91 s CAP, CHIP CERAMIC 1MF B
C68 1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C81 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C82 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C83 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C84 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C85 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C86 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C87 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C88 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
CN1 1-793-093-91 o CONNECTOR, BOARD TO BOARD 60P
CN2 1-784-210-21 s CONNECTOR 7P
D1 8-719-069-28 s DIODE 1SS400TE-61
D2 8-719-065-59 s DIODE MBR0530T1
D3 8-719-065-59 s DIODE MBR0530T1
D4 8-719-069-28 s DIODE 1SS400TE-61
D5 8-719-065-59 s DIODE MBR0530T1
D6 8-719-065-59 s DIODE MBR0530T1
D7 8-719-072-43 s DIODE RB050L-40TE25
D8 6-501-207-01 s DIODE CL-201HR-C-TSL
D11 8-719-083-57 s DIODE UDZSTE-173.6B
D12 8-719-083-57 s DIODE UDZSTE-173.6B
D13 8-719-083-57 s DIODE UDZSTE-173.6B
D14 8-719-083-57 s DIODE UDZSTE-173.6B
D15 8-719-083-57 s DIODE UDZSTE-173.6B
D16 8-719-083-57 s DIODE UDZSTE-173.6B
D17 8-719-083-57 s DIODE UDZSTE-173.6B
D18 8-719-083-57 s DIODE UDZSTE-173.6B
D19 8-719-069-56 s DIODE UDZSTE-176.2B
D20 6-500-695-01 s DIODE UDZSTE-172.7B
D21 6-500-695-01 s DIODE UDZSTE-172.7B
D22 8-719-083-58 s DIODE UDZSTE-173.9B
D23 8-719-083-58 s DIODE UDZSTE-173.9B
D24 8-719-069-28 s DIODE 1SS400TE-61
E1 1-535-877-22 s CHIP, CHECKER
E2 1-535-877-22 s CHIP, CHECKER
IC1 6-707-828-01 s IC MM1431ANRE
IC2 8-759-338-95 s IC NJM2903V(TE2)
IC3 6-707-828-01 s IC MM1431ANRE
IC4 8-759-338-95 s IC NJM2903V(TE2)
IC5 6-702-510-01 s IC TPS5120DBTRG4
IC6 6-702-510-01 s IC TPS5120DBTRG4
IC7 6-705-481-01 s IC LT1931ES5#TR
L1 1-419-630-21 s COIL, CHOKE 4.7UH
L2 1-400-869-11 s COIL, CHOKE 47UH
L3 1-456-622-21 s COIL, CHOKE 1UH
L4 1-416-344-21 s COIL, CHOKE 10UH
L5 1-456-622-21 s COIL, CHOKE 1UH
L6 1-400-868-11 s COIL, CHOKE 22UH
L7 1-400-869-11 s COIL, CHOKE 47UH
L8 1-456-622-21 s COIL, CHOKE 1UH
L9 1-456-622-21 s COIL, CHOKE 1UH
------------
RE-249 BOARD
------------
Ref. No.
or Q'ty Part No. SP Description
1pc A-1258-006-A s MOUNTED CIRCUIT BOARD, RE-249
C1 1-125-827-91 s CAP, CHIP CERAMIC 1MF B
C3 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C4 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C5 1-125-827-91 s CAP, CHIP CERAMIC 1MF B
C7 1-112-046-11 s CAP, CERAMIC 4.7MF X6S 2012
C8 1-112-777-11 s CAP, CERAMIC 0.01MF X7R 1005
C9 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C10 1-112-777-11 s CAP, CERAMIC 0.01MF X7R 1005
C11 1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C12 1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C13 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C14 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C15 1-112-777-11 s CAP, CERAMIC 0.01MF X7R 1005
C16 1-112-778-11 s CAP, CERAMIC 0.022MF X7R 1005
C17 1-162-969-91 s CAP, CERAMIC 6800PF B 1608
C18 1-112-778-11 s CAP, CERAMIC 0.022MF X7R 1005
C19 1-162-969-91 s CAP, CERAMIC 6800PF B 1608
C20 1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C21 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C22 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C23 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C24 1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C25 1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C26 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C27 1-100-827-21 s CAP, ELECT 150MF (8X7)
C28 1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C29 1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C30 1-135-349-21 s CAP, ELECT 22MF (6.3X6)
C31 1-100-827-21 s CAP, ELECT 150MF (8X7)
C32 1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C33 1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C34 1-112-777-11 s CAP, CERAMIC 0.01MF X7R 1005
C35 1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C36 1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C37 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C38 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C39 1-112-777-11 s CAP, CERAMIC 0.01MF X7R 1005
C40 1-112-778-11 s CAP, CERAMIC 0.022MF X7R 1005
C41 1-162-969-91 s CAP, CERAMIC 6800PF B 1608
C42 1-112-778-11 s CAP, CERAMIC 0.022MF X7R 1005
C43 1-162-969-91 s CAP, CERAMIC 6800PF B 1608
C44 1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C45 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C46 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C47 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C48 1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C49 1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C50 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C51 1-100-827-21 s CAP, ELECT 150MF (8X7)
C52 1-135-349-21 s CAP, ELECT 22MF (6.3X6)
C53 1-100-827-21 s CAP, ELECT 150MF (8X7)
C54 1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C55 1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C56 1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C57 1-112-046-11 s CAP, CERAMIC 4.7MF X6S 2012
C58 1-125-827-91 s CAP, CHIP CERAMIC 1MF B
C59 1-164-882-81 s CAP,CHIP CERAMIC 220PF CH 1005
Содержание HDVF-C35W
Страница 4: ...2 E HDVF C35W 8 Board Layouts LE 341 8 1 LE 342 8 1 PR 308 8 2 PR 309 8 3 RE 249 8 4 SW 1366 8 4 ...
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Страница 62: ...Printed in Japan Sony Corporation 2007 6 22 2007 HDVF C35W SY J E 9 968 349 01 ...