1-27
HVR-1500
1-3. Electrical Parts List
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AVP-7 BOARD
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Ref. No.
or Q'ty Part No. SP Description
1pc A-1185-254-A s MOUNTED CIRCUIT BOARD, AVP-7
4pcs 3-776-750-02 s SCREW +BVTT 2.5X6(S)
2pcs 7-682-546-04 s SCREW +B 3X5
3pcs 7-685-146-11 s SCREW +P 3X8 TYPE2 NON-SLIT
C1 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C2 1-127-760-91 s CAP, CHIP CERAMIC 4.7MF B 2012
C4 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C51 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C52 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C53 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C54 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C56 1-126-393-21 s CAP, CHIP ELECT 33MF (5X5.7)
C57 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C58 1-126-393-21 s CAP, CHIP ELECT 33MF (5X5.7)
C59 1-126-395-21 s CAP, CHIP ELECT 22MF (5X5.7)
C60 1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C61 1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C62 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C63 1-127-760-91 s CAP, CHIP CERAMIC 4.7MF B 2012
C64 1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C65 1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C66 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C67 1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C68 1-127-760-91 s CAP, CHIP CERAMIC 4.7MF B 2012
C70 1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C71 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C72 1-164-878-81 s CAP,CHIP CERAMIC 150PF CH 1005
C74 1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C75 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C76 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C77 1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C78 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C79 1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C80 1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C81 1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C82 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C83 1-126-393-21 s CAP, CHIP ELECT 33MF (5X5.7)
C84 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C85 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C86 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C87 1-164-937-81 s CAP, CHIPCERAMIC 1000PF B 1005
C88 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C89 1-165-678-21 s CAP, ELECT 33MF
C90 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C91 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C92 1-165-678-21 s CAP, ELECT 33MF
C93 1-165-678-21 s CAP, ELECT 33MF
C94 1-127-760-91 s CAP, CHIP CERAMIC 4.7MF B 2012
C95 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C96 1-126-395-21 s CAP, CHIP ELECT 22MF (5X5.7)
C97 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C98 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C99 1-164-943-81 s CAP,CHIP CERAMIC 10000PF B1005
C100 1-164-943-81 s CAP,CHIP CERAMIC 10000PF B1005
C101 1-164-943-81 s CAP,CHIP CERAMIC 10000PF B1005
C102 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C151 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C152 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C153 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
(AVP-7 BOARD)
Ref. No.
or Q'ty Part No. SP Description
C154 1-164-847-81 s CAP, CHIP CERAMIC 7PF CH 1005
C155 1-164-847-81 s CAP, CHIP CERAMIC 7PF CH 1005
C156 1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C158 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C159 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C160 1-100-611-91 s CAP, CERAMIC 22MF C (2012)
C161 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C162 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C163 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C164 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C165 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C167 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C168 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C169 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C170 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C173 1-100-611-91 s CAP, CERAMIC 22MF C (2012)
C174 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C175 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C176 1-127-760-91 s CAP, CHIP CERAMIC 4.7MF B 2012
C177 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C201 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C202 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C203 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C204 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C205 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C206 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C208 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C209 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C210 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C211 1-127-988-81 s CAP,CHIP CERAMIC0.015MF B 1005
C212 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C213 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C214 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C215 1-164-878-81 s CAP,CHIP CERAMIC 150PF CH 1005
C216 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C217 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C218 1-164-878-81 s CAP,CHIP CERAMIC 150PF CH 1005
C219 1-164-878-81 s CAP,CHIP CERAMIC 150PF CH 1005
C220 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C221 1-100-611-91 s CAP, CERAMIC 22MF C (2012)
C222 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C223 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C224 1-164-937-81 s CAP, CHIPCERAMIC 1000PF B 1005
C225 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C251 1-127-760-91 s CAP, CHIP CERAMIC 4.7MF B 2012
C252 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C253 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C254 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C255 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C256 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C257 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C258 1-127-760-91 s CAP, CHIP CERAMIC 4.7MF B 2012
C259 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C260 1-164-866-81 s CAP, CHIP CERAMIC 47PF CH 1005
C261 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C262 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C263 1-127-760-91 s CAP, CHIP CERAMIC 4.7MF B 2012
C264 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C265 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
Содержание HDV HVBK-1505
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Страница 274: ...Printed in Japan Sony Corporation 2007 4 08 2007 HVR 1500 J HVR 1500 SY J E 9 968 317 01 ...