4-143
HDCU3300/MM (J,E)
(SDP-15 BOARD suffix 12)
Ref. No.
or Q’ty Part No. SP Description
C413 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C414 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C415 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C416 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C417 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C418 1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C419 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C420 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C423 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C424 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C425 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C426 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C428 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C429 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C430 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C431 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C432 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C433 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C436 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C437 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C439 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C440 1-128-416-21 s CAP, CHIP ELECT 100MF
C447 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C448 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C449 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C450 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C451 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C452 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C453 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C454 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C455 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C456 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C457 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C459 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C460 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C461 1-216-864-91 s CONDUCTOR, CHIP (1608)
C462 1-216-864-91 s CONDUCTOR, CHIP (1608)
C466 1-216-864-91 s CONDUCTOR, CHIP (1608)
C467 1-216-864-91 s CONDUCTOR, CHIP (1608)
C471 1-216-864-91 s CONDUCTOR, CHIP (1608)
C472 1-216-864-91 s CONDUCTOR, CHIP (1608)
C476 1-216-864-91 s CONDUCTOR, CHIP (1608)
C477 1-216-864-91 s CONDUCTOR, CHIP (1608)
C481 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C483 1-216-864-91 s CONDUCTOR, CHIP (1608)
C484 1-216-864-91 s CONDUCTOR, CHIP (1608)
C488 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C489 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C502 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C503 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C504 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012)
C506 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012)
C507 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012)
C701 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C702 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C703 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C704 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C705 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C706 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
(SDP-15 BOARD suffix 12)
Ref. No.
or Q’ty Part No. SP Description
C707 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C708 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C709 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C710 1-125-891-91 s CAP, CHIP CERAMIC0.47MF B 1608
C711 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C712 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C713 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C715 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C717 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C718 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C719 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C720 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C721 1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C722 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C723 1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C724 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C725 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C726 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C727 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C728 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C729 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C731 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C732 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
CN103 1-695-480-21 o PIN, CONNECTOR (PC BOARD) 2P
CN104 1-770-470-21 o PIN, CONNECTOR (PC BOARD) 6P
CN105 1-815-921-11 s JACK, MODULAR
CN301 1-764-080-21 o PIN, CONNECTOR (PC BOARD) 8P
CN401 1-785-553-21 o CONNECTOR, BOARD TO BOARD 120P
D1 8-719-017-03 s DIODE 02DZ4.7-TPH3
D2 8-719-017-03 s DIODE 02DZ4.7-TPH3
D3 8-719-017-03 s DIODE 02DZ4.7-TPH3
D4 8-719-017-03 s DIODE 02DZ4.7-TPH3
D5 8-719-024-81 s DIODE 1SS300-TE85L
D101 8-719-024-81 s DIODE 1SS300-TE85L
D102 8-719-024-81 s DIODE 1SS300-TE85L
D103 8-719-024-81 s DIODE 1SS300-TE85L
D401 8-719-989-77 s DIODE SC802-04-TE12RA
D402 8-719-989-77 s DIODE SC802-04-TE12RA
D403 8-719-988-61 s DIODE 1SS355TE-17
D404 8-719-988-61 s DIODE 1SS355TE-17
E1 1-535-877-22 s CHIP, CHECKER
E2 1-535-877-22 s CHIP, CHECKER
E3 1-535-877-22 s CHIP, CHECKER
FB1 1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB2 1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB3 1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB4 1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB5 1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB6 1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB101 1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB203 1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB204 1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB205 1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB206 1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB207 1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB208 1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB209 1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB210 1-414-554-21 s FERRITE, EMI (SMD) (1608)
Содержание HDCU3300 HD
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