4-56
HDCU3300/MM (J,E)
(DPR-271B BOARD)
Ref. No.
or Q’ty Part No. SP Description
C1036 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1037 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1039 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1040 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1041 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1042 1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C1043 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C1044 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1045 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1046 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1047 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1048 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1049 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1050 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1052 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1053 1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C1054 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1056 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1057 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1058 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1059 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1060 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1061 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1062 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1063 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1064 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1065 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1066 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C1068 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1070 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1071 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1072 1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C1073 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C1074 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1075 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1077 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1078 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C1079 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1080 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1081 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1082 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1083 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C1084 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1085 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1086 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1087 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1088 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1089 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1090 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1091 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1092 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1093 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1094 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1095 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1096 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1097 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1098 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1099 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1100 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
(DPR-271B BOARD)
Ref. No.
or Q’ty Part No. SP Description
C1101 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1102 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1103 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1104 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1105 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1106 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1108 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1109 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1110 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1111 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1112 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1113 1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C1114 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1115 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1117 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1118 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1119 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1120 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1121 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C1122 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C1123 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1124 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1125 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C1126 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1127 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1128 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C1129 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1130 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1131 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1132 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1133 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C1134 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C1135 1-125-891-91 s CAP, CHIP CERAMIC0.47MF B 1608
C1136 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C1138 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C1139 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C1140 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C1141 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C1142 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C1143 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C1144 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C5004 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C5005 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C5006 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
CN301 1-764-093-21 o PIN, CONNECTOR (PC BOARD) 8P
D3 8-719-074-31 s DIODE CL-196YG-CD-T
D4 8-719-820-42 s DIODE 1SS302-TE85L
D5 8-719-820-42 s DIODE 1SS302-TE85L
D201 8-719-074-31 s DIODE CL-196YG-CD-T
D202 8-719-074-31 s DIODE CL-196YG-CD-T
D203 8-719-064-41 s DIODE CL-191Y-CD-T
D204 8-719-064-41 s DIODE CL-191Y-CD-T
D205 8-719-074-31 s DIODE CL-196YG-CD-T
D206 8-719-074-31 s DIODE CL-196YG-CD-T
D207 8-719-074-31 s DIODE CL-196YG-CD-T
D208 8-719-074-31 s DIODE CL-196YG-CD-T
D209 8-719-074-31 s DIODE CL-196YG-CD-T
D210 8-719-074-31 s DIODE CL-196YG-CD-T
Содержание HDCU3300 HD
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