HAP-Z1ES
HAP-Z1ES
39
39
For Schematic Diagrams.
Note:
• All capacitors are in
μ
F unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in
Ω
and 1/4 W or less unless otherwise
speci
fi
ed.
•
f
: Internal component.
•
2
: Non
fl
ammable resistor.
•
C
: Panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
•
A
: B+ Line.
•
B
: B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : POWER ON
• Voltages are taken with VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
:
AUDIO
(ANALOG)
J
:
AUDIO
(DIGITAL)
f
:
HDD
N
:
USB
d
:
LAN
G
: WIRELESS LAN
E
:
VIDEO
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
For Printed Wiring Boards.
Note:
•
X
: Parts extracted from the component side.
•
Y
: Parts extracted from the conductor side.
•
f
: Internal component.
•
: Pattern from the side which enables seeing.
(The other layers’ patterns are not indicated.)
Caution:
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• Circuit Boards Location
• Indication of transistor.
C
B
These are omitted.
E
Q
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
Note:
The components identi-
fi
ed by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number speci
fi
ed.
Note:
Les composants identi
fi
és
par une marque
0
sont
critiques pour la sécurité.
Ne les remplacer que par
une pièce portant le nu-
méro spéci
fi
é.
• Abbreviation
CND : Canadian model
• FPGA DSP and MAIN boards are multi-layer printed
board. However, the patterns of intermediate layers have
not been included in diagrams.
• Lead layouts
surface
CSP (Chip Size Package)
Lead layout of conventional IC
Note:
When the complete MAIN board is replaced, refer to
“NOTE OF REPLACING THE COMPLETE MAIN
BOARD” and “CHECKING METHOD OF NET-
WORK CONNECTION” on page 5.
Note:
When the complete MAIN board is replaced, refer to
“NOTE OF REPLACING THE COMPLETE MAIN
BOARD” and “CHECKING METHOD OF NET-
WORK CONNECTION” on page 5.
DCDC board
STANBY board
MAIN board
WLAN/BT COMBO card
(WBC1)
U-COM board
IO board
KEY JOG board
FPGA DSP board
SPIRITOSO-ANT-R board
POWER KEY board
APOWER board
AUDIO board
AUUBOUT board
SPIRITOSO-LCD board
LED board
SPIRITOSO-ANT-L board
FAN-CONNECT board
Содержание HAP-Z1ES
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