Connecting
6.2 Connecting a decentralized design
Panel PC 670 V2/870 V2, Control unit
Operating Instructions, Edition 03/2004, CD Documentation and Drivers
6-5
Equipotential bonding requirements
Reduce the differences in potential by laying the equipotential bonding cables in such a way
that the affected electronic components function perfectly. Please comply with the following
guidelines when setting up equipotential bonding:
•
The lower the impedance of the equipotential bonding cable, the greater the effectiveness
of the equipotential bonding.
•
When two system parts are connected by means of a shielded signal cable, and their
shields are both connected to the ground or protected conductor, the following must be
observed: The impedance of the additonal equipotential bonding cable amounts to 10 %
of the shield impedance, at the most.
•
Make sure that the diameter of the equipotential bonding cable is proportional to the
maximum equalization current. Equipotential bonding cables with a 16 mm diameter have
proven themselves in practice. 2.
•
Use equipotential bonding cables made of copper or galvanized steel. Connect the
cables extensively with the ground or protective conductor. Protect the ground or
protective conductor from corrosion.
•
Lay the equipotential bonding cable in such a way that the area between the equipotential
bonding cable and signal cables is as small as possible.
6.2.4
Connecting equipotential bonding.
Introduction
Caution
Equipotential bonding cable
Provide adequate cable diameter when setting up PROFIBUS DP networks and MPI
networks. Otherwise interface components will be damaged or destroyed.
Cable shileds are not suitable for the equipotential bonding. Use only the prescribed
equipotential bonding cable. Make sure that the diameter of the equipotential bonding cable
is at least 16 mm².
Procedure
Caution
Please follow the described guidelines concerning equipotential bonding. Otherwise
interface components will be damaged or destroyed.
1. Connect the device to the equipotential bonding as illustrated in the chapter "Connecting
a decentralized design."
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