SEPTENTRIO mosaic Series, Руководство по оборудованию

Страница: 39 / 57

39
39
Product Handling
39
Region Guideline
Ramp up max 2 ℃ /sec
Soak time 60-120 sec
Time Above Liquidus (TAL) 45-80 sec
Peak temperature 245 ℃
Cooling rate max 4°C/sec
Don’t use glue underneath the component, as this might lift the component and
jeopardize bonding. Cleaning the module (water, ultrasonic, solvent,…) is not allowed as it
could affect its performance.
The recommended stencil thickness is 0.125mm (5mil). The final stencil aperture design
and thickness must be
adjusted to the customer’s specific manufact uring processes. In
any case, the stencil thickness shall not be less than 0.1mm (4mil).
Mount the part with the largest available placement nozzle, attached to the center of the
shield. Use the slowest possible speed of the pick and place machine.
When implemented on a double-sided PCB, the mosaic module has to be assembled
during the final reflow cycle and cannot be reflowed when located on the bottom side of
the board.
If the motherboard thickness is 1.2mm or less, it is recommended to support the assembly
during the reflow process to minimize bow of the motherboard.