Shenzhen SCOTLE Technology
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Email:[email protected] Tel:86075589378931
http://www.scotle.com/
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11
Adjust the handle up and
down
Adjust the upper zone of
the position up and down
Rotating the handle
12
Upper heating nozzle
To focus the hot air
Pull air from the BGA suitable
location
13
Lower part of the
supporting frame
Prevent the PCB board fall
down
Move the right position to
withstand
14
Lower heating nozzle
To focus the hot air
Pull air from the BGA suitable
location
15
Cross flow fan
Cooling the PCB board
after weilding
16
Infrared heating zone
BGA rework with
warm-up
17
Temperature Interface
Connect an external
galvanic , measure the
actual temperature
Directly connect temperature
line
18
Touch screen
Data storage system
platform
Scotle-HR460C specifications
Total Power consumption
4800W
Top heater consumption
800W
Bottom heater consumption
Lower heater 1200W
,
bottom pre-heater
2700W(lager heating area)
Voltage
AC220V± 10
%
50/60Hz
Dimensions
L800× W900× H950 mm
Positioning
V-groove, PCB support can be adjusted in any
direction with external universal fixture
Temperature control
K Type temperature Sensor and Closed loop
Temp accuracy
± 2
℃
PCB size
Max 500× 400 mm Min 22× 22 mm
BGA chip
2X2-80X80mm
Minimum chip spacing
0.15mm
External Temperature Sensor
1
,
can be added
Net weight
45kg
Содержание Scotle-HR460C
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