SCOTLE Scotle-HR460C, Руководство пользователя

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Shenzhen SCOTLE Technology
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Email:sales@scotle.com Tel:86075589378931 http://www.scotle.com/
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automatic status. When the temperature is about to run out, the machine
will buzz automatically, now use the vacuum suction pen to remove away
the BGA chip quickly, then move the PCBA board from the fixture.
4.
When do soldering , adjust the cooling fan to automatic status and
turn off the vacuum suction system, and the temperature is about to
running out, the machine will buzz to alarm, and the cooling fan begin to
cool the BGA and PCB board, and the hot air nozzles blow cold wind now.
Move th e top h eater up to mak e sur e th e ho t air nozzl e is 3 -5mm
away from th e BGA surfac e and after getting cooling for 30 to 40
seconds, or th e Start bu tton indicator off, move the PCB bo ard
away from the fixture.
5.
Before soldering the BGA, make sure the PCB pads and BGA solder balls are
100% ok. After place the BGA , we should do cosmetic examine. If they
looks not ok, do not do soldering to avoid damaging the BGA and PCB
boards.
6.
The BGA rework station surface need to be cleaned often, especially the
infrared area. Because residue on the area will affect the normal heating
distribute and reduce the use life of heating.
Web:
www.scotle.com
Mail: Sales@scotle.com
Tel: 86075589378931