S&T kontron COMe-bV26, Руководство пользователя

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COMe-bV26 - Rev. 1.0, User Guide
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 Memory size
 Memory module (#G) /eMMC pseudo SLC memory (#S)
1.3. COM Express® Documentation
The COM Express® specification defines the COM Express® module form factor, pinout and signals. For more
information about the COM Express® specification, visit the PCI Industrial Computer Manufacturers Group (PICMG®)
website.
1.4. COM Express® Functionality
All Kontron COM Express® basic modules contain two 220-pin connectors, each of which has two rows called row
A & B on the primary connector and row C & D on the secondary connector. The COM Express® basic type 6 Computer-
On-Module (COM) features the following maximum amount of interfaces according to the PICMG module pinout type.
Table 1: Type 6 and COM-bV26 Functionality
Feature Type 6 COM-bV26
HD Audio 1x 1x
Gbit Ethernet 1x 1x up to 2.5 GbE
Serial ATA Gen3 4x 4x
PCI Express x 1 4x 4x PCIe Gen 3 and 4x PCIe Gen 2
PCI Express x16 (PEG) 1x 1x (x8 PEG)
USB Client - 4x
USB 4x USB 3.0/2.0
8x USB 2.0 4x USB 3.1 Gen 2/USB 2.0
8x USB 2.0 (4x dedicated USB 2.0)
VGA 1x 1x (option)
LVDS (eDP) 1x LVDS dual channel eDP or option for LVDS
DP++ (DP/HDMI/DVI) 3x 3x
SPI 1x 1x
LPC 1x 1x (used for external LPC on carrier board)
External SMB 1x 1x
External I2C 1x 1x
SDIO shared with GPIO 1x option -
GPIO or SDIO 8x 8x GPIO
UART (2-wire COM) 2x 2x
FAN PWM out 1x 1x
1.5. COM Express® Benefits
COM Express® defines a Computer-On-Module (COM), with all the components necessary for a bootable host
computer, packaged as a highly integrated computer. All Kontron COM Express® modules are very compact and
feature a standardized form factor and a standardized connector layout that carry a specified set of signals. Each
COM module is based on the COM Express® specification. This standardization allows designers to create a single-
system carrier board that can accept present and future COM Express® modules.
The carrier board designer can optimize exactly how each of these functions implements physically. Designers can
place connectors precisely where needed for the application, on a carrier board optimally designed to fit a system’s
packaging.
A single carrier board design can use a range of COM Express® modules with different sizes and pinouts. This
flexibility differentiates products at various price and performance points and provides a built-in upgrade path when
designing future-proof systems. The modularity of a COM Express® solution also ensures against obsolescence when