Samsung Electronics
10-7
Glossary
Image sticking
:
(Refer to Image retention.)
Interconnect pad groups
:
A group of connection terminals that attach to individual connector. (also referred to as terminal block.)
Interconnect pad pitch
:
Mutual measurements for individual of interconnect pad group.
Interconnect pad spacing
:
The size of non-electric conductive area between individual terminal.
Inter-electrode gap
:
In Three electrodes plasma panel, the measurement of sustained voltage separated from outside discharge
space.
Ion bombardment
:
The bombardment of energetic ions in the surface of solid matter. The transfer of kinetic energy toward sur-
face from ions can cause electron release, ion or neutron release and temperature change in surface.
Life time
:
Time during device exerts its function. Commonly known as mean time failure (MTTF).
Low melting point glass
:
Glass of which melting point (temperature with viscosity of 1014.5 poise) is relatively low.
Since glass is non- crystalline, the word melting is not appropriate, but it gets more fluid as it becomes hot.
Luminance
:
Colloquial term for measurement of brightness of display.
It also refers to display related CIE Y constituent. it is expressed by cd/m2.
Luminance efficacy
:
It refers to gloss output against the total display consumption power. It is calculated by the value
generated through dividing gloss output of
∞
ÌªÛ white substance with gross consumption power. It is
expressed as lumen/watt.
Luminance efficiency
:
Gloss output value according to consumption power increase, calculated by the value generated through
dividing gloss output of
∞
ÌªÛ white substance with white screen power consumption increase against black
screen. It is expressed as lumen/watt.
Luminance loading
:
Luminance decline that takes place when white square luminance increases into full size all white square.
Matrix(type) PDP
:
Plasma display panel made up of matrix with rows and columns.
Matrix type
:
Refer to matrix PDP
Maximum firing voltage
:
Voltage value required for triggering discharge in all cells.
Maximum sustain voltage
:
Maximum drive voltage required not to turn off the cells.
Содержание PPM42S2X/XAA
Страница 2: ...ELECTRONICS Samsung Electronics Co Ltd APR 2002 Printed in Korea AA82 ...
Страница 10: ...3 2 Samsung Electronics MENO ...
Страница 25: ...Circuit Operation Description Samsung Electronics 5 3 5 1 2 D PDP PS 42 BLOCK DIAGRAM ...
Страница 38: ...Circuit Operation Description 5 16 Samsung Electronics 5 2 3 D DRIVER CIRCUIT DIAGRAM ...
Страница 39: ...Circuit Operation Description Samsung Electronics 5 17 5 2 3 E DRIVER BOARD CONNECTOR LAYOUT ...
Страница 40: ...Circuit Operation Description 5 18 Samsung Electronics ...
Страница 41: ...Circuit Operation Description Samsung Electronics 5 19 ...
Страница 42: ...Circuit Operation Description 5 20 Samsung Electronics ...
Страница 43: ...Circuit Operation Description Samsung Electronics 5 21 ...
Страница 44: ...Circuit Operation Description 5 22 Samsung Electronics ...
Страница 45: ...Circuit Operation Description Samsung Electronics 5 23 ...
Страница 46: ...Circuit Operation Description 5 24 Samsung Electronics ...
Страница 47: ...Circuit Operation Description Samsung Electronics 5 25 ...
Страница 48: ...Circuit Operation Description 5 26 Samsung Electronics ...
Страница 49: ...Circuit Operation Description Samsung Electronics 5 27 ...
Страница 50: ...Circuit Operation Description 5 28 Samsung Electronics ...
Страница 51: ...Circuit Operation Description Samsung Electronics 5 29 ...
Страница 52: ...Circuit Operation Description 5 30 Samsung Electronics ...
Страница 53: ...Circuit Operation Description Samsung Electronics 5 31 5 3 Logic part 5 3 1 Logic Board Block diagram ...
Страница 76: ...Circuit Operation Description 5 54 Samsung Electronics 29 Jig board U1 LE01 pin35 30 Jig board U1 LE01 pin46 ...
Страница 77: ...Circuit Operation Description Samsung Electronics 5 55 31 Jig board U2 LE02 pin35 32 Jig board U2 LE02 pin46 ...
Страница 82: ...Circuit Operation Description 5 60 Samsung Electronics ...
Страница 83: ...Circuit Operation Description Samsung Electronics 5 61 ...
Страница 84: ...Circuit Operation Description 5 62 Samsung Electronics MEMO ...
Страница 93: ...Exploded View Parts List Samsung Electronics 7 1 7 Exploded View Parts List 7 1 PPM42S2X XAA ...
Страница 106: ...Electrical Parts List 8 12 Samsung Electronics MEMO ...
Страница 128: ...10 14 Samsung Electronics MEMO ...
Страница 130: ...11 2 Samsung Electronics MENO ...
Страница 133: ...Samsung Electronics Schematic Diagrams 12 3 TP01 12 3 SCALER3 3D COMB FILTER TP01 CVBS IN ...
Страница 134: ...Schematic Diagrams 12 4 Samsung Electronics 12 4 SCALER4 VIDEO DECODER PIP FIRST IN OUTPUT ...
Страница 135: ...Samsung Electronics Schematic Diagrams 12 5 12 5 SCALER5 VIDEO DA CON ...
Страница 137: ...Samsung Electronics Schematic Diagrams 12 7 12 7 SCALER7 ADC VIDEO TP20 TP21 TP19 TP19 HS OUT TP20 VHS TP21 VCLK ...
Страница 138: ...Schematic Diagrams 12 8 Samsung Electronics 12 8 SCALER8 ADC PC TP23 TP24 TP22 TP22 MHSYNC TP23 MHS TP24 PCLK ...
Страница 140: ...Schematic Diagrams 12 10 Samsung Electronics 12 10 SCALER10 POWER DEGUGER MEMORY REMOCON RS232 RTC ...
Страница 141: ...Samsung Electronics Schematic Diagrams 12 11 12 11 SOUND ...
Страница 143: ...Samsung Electronics Schematic Diagrams 12 13 12 13 CONTROL REMOCON CONTROL REMOCON ...